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Nishikawa, Hiroshi, Alhazaa, Abdulaziz N., He, Si Liang, Almajid, Abdulhakim A., Soliman, Mahmoud S. (2016) Interfacial Reaction between Sn-Ag-Cu-Mg Solder and ENIG Substrate. Key Engineering Materials, 701. 216-219 doi:10.4028/www.scientific.net/kem.701.216

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Reference TypeJournal (article/letter/editorial)
TitleInterfacial Reaction between Sn-Ag-Cu-Mg Solder and ENIG Substrate
JournalKey Engineering Materials
AuthorsNishikawa, HiroshiAuthor
Alhazaa, Abdulaziz N.Author
He, Si LiangAuthor
Almajid, Abdulhakim A.Author
Soliman, Mahmoud S.Author
Year2016 (July)Volume701
PublisherTrans Tech Publications, Ltd.
DOIdoi:10.4028/www.scientific.net/kem.701.216Search in ResearchGate
Generate Citation Formats
Mindat Ref. ID12025544Long-form Identifiermindat:1:5:12025544:5
GUID0
Full ReferenceNishikawa, Hiroshi, Alhazaa, Abdulaziz N., He, Si Liang, Almajid, Abdulhakim A., Soliman, Mahmoud S. (2016) Interfacial Reaction between Sn-Ag-Cu-Mg Solder and ENIG Substrate. Key Engineering Materials, 701. 216-219 doi:10.4028/www.scientific.net/kem.701.216
Plain TextNishikawa, Hiroshi, Alhazaa, Abdulaziz N., He, Si Liang, Almajid, Abdulhakim A., Soliman, Mahmoud S. (2016) Interfacial Reaction between Sn-Ag-Cu-Mg Solder and ENIG Substrate. Key Engineering Materials, 701. 216-219 doi:10.4028/www.scientific.net/kem.701.216
In(n.d.) Key Engineering Materials Vol. 701. Trans Tech Publications, Ltd.

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Yoon, Jeong Won, Jung, Seung Boo (2006) Interfacial Reaction of Cu/Sn-Ag/ENIG Sandwich Solder Joint during Aging. Advanced Materials Research, 15. 1001-1007 doi:10.4028/www.scientific.net/amr.15-17.1001
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Jin, Zhe Ming, Kato, Hiroshi, Kageyama, Kensuke (2004) Ultrasonic Evaluation of Fatigue Damaging Process of Cu Plates Joined with Sn-3.8wt%Ag-1.2wt%Cu Alloy Solder. Key Engineering Materials, 270. 1189-1195 doi:10.4028/www.scientific.net/kem.270-273.1189
 
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