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Lutfi, Maisarah, Yusof, Farazila, Ariga, Tadashi, Singh, Ramesh, Bin Abd Shukor, Mohd Hamdi (2016) Interfacial Reaction Analysis of Cu-Sn-Ni-P/Cu Joint Using Microwave Hybrid Heating. Key Engineering Materials, 701. 148-153 doi:10.4028/www.scientific.net/kem.701.148

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Reference TypeJournal (article/letter/editorial)
TitleInterfacial Reaction Analysis of Cu-Sn-Ni-P/Cu Joint Using Microwave Hybrid Heating
JournalKey Engineering Materials
AuthorsLutfi, MaisarahAuthor
Yusof, FarazilaAuthor
Ariga, TadashiAuthor
Singh, RameshAuthor
Bin Abd Shukor, Mohd HamdiAuthor
Year2016 (July)Volume701
PublisherTrans Tech Publications, Ltd.
DOIdoi:10.4028/www.scientific.net/kem.701.148Search in ResearchGate
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Mindat Ref. ID12025532Long-form Identifiermindat:1:5:12025532:2
GUID0
Full ReferenceLutfi, Maisarah, Yusof, Farazila, Ariga, Tadashi, Singh, Ramesh, Bin Abd Shukor, Mohd Hamdi (2016) Interfacial Reaction Analysis of Cu-Sn-Ni-P/Cu Joint Using Microwave Hybrid Heating. Key Engineering Materials, 701. 148-153 doi:10.4028/www.scientific.net/kem.701.148
Plain TextLutfi, Maisarah, Yusof, Farazila, Ariga, Tadashi, Singh, Ramesh, Bin Abd Shukor, Mohd Hamdi (2016) Interfacial Reaction Analysis of Cu-Sn-Ni-P/Cu Joint Using Microwave Hybrid Heating. Key Engineering Materials, 701. 148-153 doi:10.4028/www.scientific.net/kem.701.148
In(n.d.) Key Engineering Materials Vol. 701. Trans Tech Publications, Ltd.

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