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Watanabe, Hirohiko, Shimoda, Masayoshi, Hidaka, Noboru, Shohji, Ikuo (2011) Effect of Interfacial Reaction in Sn-Ag-Cu Solder Alloy with Ni Addition. Key Engineering Materials, 462. 247-252 doi:10.4028/www.scientific.net/kem.462-463.247

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Reference TypeJournal (article/letter/editorial)
TitleEffect of Interfacial Reaction in Sn-Ag-Cu Solder Alloy with Ni Addition
JournalKey Engineering Materials
AuthorsWatanabe, HirohikoAuthor
Shimoda, MasayoshiAuthor
Hidaka, NoboruAuthor
Shohji, IkuoAuthor
Year2011 (January)Volume462
PublisherTrans Tech Publications, Ltd.
DOIdoi:10.4028/www.scientific.net/kem.462-463.247Search in ResearchGate
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Mindat Ref. ID12008741Long-form Identifiermindat:1:5:12008741:1
GUID0
Full ReferenceWatanabe, Hirohiko, Shimoda, Masayoshi, Hidaka, Noboru, Shohji, Ikuo (2011) Effect of Interfacial Reaction in Sn-Ag-Cu Solder Alloy with Ni Addition. Key Engineering Materials, 462. 247-252 doi:10.4028/www.scientific.net/kem.462-463.247
Plain TextWatanabe, Hirohiko, Shimoda, Masayoshi, Hidaka, Noboru, Shohji, Ikuo (2011) Effect of Interfacial Reaction in Sn-Ag-Cu Solder Alloy with Ni Addition. Key Engineering Materials, 462. 247-252 doi:10.4028/www.scientific.net/kem.462-463.247
In(n.d.) Key Engineering Materials Vol. 462. Trans Tech Publications, Ltd.

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Shohji, Ikuo, Arai, Ryohei, Ishikawa, Hisao, Kojima, Masao (2011) Effect of Ag Content on Mechanical Properties of Lead-Free Sn-Ag-Cu-Ni-Ge Alloy. Key Engineering Materials, 462. 82-87 doi:10.4028/www.scientific.net/kem.462-463.82
Yorita, Chiko, Kobayashi, Tatsuya, Shohji, Ikuo (2011) Effect of Interfacial Reaction on Joint Strength of Semiconductor Metallization and Sn-3Ag-0.5Cu Solder Ball. Key Engineering Materials, 462. 849-854 doi:10.4028/www.scientific.net/kem.462-463.849
Shohji, Ikuo, Tsunoda, Satoshi, Watanabe, Hirohiko, Asai, Tatsuhiko (2007) Influence of Content of Ni and Ag on Microstructure and Joint Strength of Lead-Free Solder Joint with Sn-Ag-Cu-Ni-Ge. Key Engineering Materials, 353. 2033-2036 doi:10.4028/www.scientific.net/kem.353-358.2033
Shohji, Ikuo, Osawa, Tsutomu, Okashita, Takeshi, Watanabe, Hirohiko (2008) Impact Properties of Sn-0.75Cu Lead-Free Solder Ball Joint. Key Engineering Materials, 385. 745-748 doi:10.4028/www.scientific.net/kem.385-387.745
Shohji, Ikuo, Watanabe, Hirohiko, Okashita, Takeshi, Osawa, Tsutomu (2008) Impact Properties of Lead-Free Sn-Ag-Cu-Ni-Ge Solder Joint with Cu Electrode. MATERIALS TRANSACTIONS, 49 (7). 1513-1517 doi:10.2320/matertrans.mf200808
Shohji, Ikuo, Kobayashi, Tatsuya, Tohei, Tomotake (2011) Analysis of Stress-Strain Hysteresis Loop and Prediction of Thermal Fatigue Life for Chip Size Package Solder Joints. Key Engineering Materials, 462. 76-81 doi:10.4028/www.scientific.net/kem.462-463.76
Shohji, Ikuo, Tsunoda, Satoshi, Watanabe, Hirohiko, Asai, Tatsuhiko, Nagano, Megumi (2005) Reliability of Solder Joint with Sn–Ag–Cu–Ni–Ge Lead-Free Alloy under Heat Exposure Conditions. MATERIALS TRANSACTIONS, 46 (12). 2737-2744 doi:10.2320/matertrans.46.2737
MITSUI, Kohei, SHOHJI, Ikuo, KOBAYASHI, Tatsuya, WATANABE, Hirohiko (2019) Effect of Addition of Trace Ni and Ge into Sn-Sb-Ag High Temperature Lead-free Solder Alloy on its Mechanical Properties. Journal of Smart Processing, 9 (3) 133-139 doi:10.7791/jspmee.9.133
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