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Jamadon, Nashrah, Tan, Ai, Yusof, Farazila, Ariga, Tadashi, Miyashita, Yukio, Hamdi, Mohd (2016) Utilization of a Porous Cu Interlayer for the Enhancement of Pb-Free Sn-3.0Ag-0.5Cu Solder Joint. Metals, 6 (9). 220pp. doi:10.3390/met6090220

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Reference TypeJournal (article/letter/editorial)
TitleUtilization of a Porous Cu Interlayer for the Enhancement of Pb-Free Sn-3.0Ag-0.5Cu Solder Joint
JournalMetals
AuthorsJamadon, NashrahAuthor
Tan, AiAuthor
Yusof, FarazilaAuthor
Ariga, TadashiAuthor
Miyashita, YukioAuthor
Hamdi, MohdAuthor
Year2016 (September 15)Volume6
Issue9
PublisherMDPI AG
DOIdoi:10.3390/met6090220Search in ResearchGate
Generate Citation Formats
Mindat Ref. ID7992887Long-form Identifiermindat:1:5:7992887:6
GUID0
Full ReferenceJamadon, Nashrah, Tan, Ai, Yusof, Farazila, Ariga, Tadashi, Miyashita, Yukio, Hamdi, Mohd (2016) Utilization of a Porous Cu Interlayer for the Enhancement of Pb-Free Sn-3.0Ag-0.5Cu Solder Joint. Metals, 6 (9). 220pp. doi:10.3390/met6090220
Plain TextJamadon, Nashrah, Tan, Ai, Yusof, Farazila, Ariga, Tadashi, Miyashita, Yukio, Hamdi, Mohd (2016) Utilization of a Porous Cu Interlayer for the Enhancement of Pb-Free Sn-3.0Ag-0.5Cu Solder Joint. Metals, 6 (9). 220pp. doi:10.3390/met6090220
In(2016, September) Metals Vol. 6 (9) MDPI AG

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Jamadon, Nashrah Hani, Miyashita, Yukio, Yusof, Farazila, Hamdi, Mohd, Otsuka, Yuichi, Ariga, Tadashi (2014) Formation behaviour of reaction layer in Sn-3.0Ag-0.5Cu solder joint with addition of porous Cu interlayer. IOP Conference Series: Materials Science and Engineering, 61. 12020pp. doi:10.1088/1757-899x/61/1/012020
Lutfi, Maisarah, Yusof, Farazila, Ariga, Tadashi, Singh, Ramesh, Bin Abd Shukor, Mohd Hamdi (2016) Interfacial Reaction Analysis of Cu-Sn-Ni-P/Cu Joint Using Microwave Hybrid Heating. Key Engineering Materials, 701. 148-153 doi:10.4028/www.scientific.net/kem.701.148
Sami, Mian Muhammad, Zaharinie, Tuan, Yusof, Farazila, Ariga, Tadashi (2020) Investigation on Strength and Microstructural Evolution of Porous Cu/Cu Brazed Joints Using Cu-Ni-Sn-P Filler. Metals, 10 (3). 416pp. doi:10.3390/met10030416
Janasekaran, Shamini, Tan, Ai, Yusof, Farazila, Abdul Shukor, Mohd (2016) Influence of the Overlapping Factor and Welding Speed on T-Joint Welding of Ti6Al4V and Inconel 600 Using Low-Power Fiber Laser. Metals, 6 (6). 134pp. doi:10.3390/met6060134
Rajendran, Sri Harini, Hwang, Seung Jun, Jung, Jae Pil (2020) Shear Strength and Aging Characteristics of Sn-3.0Ag-0.5Cu/Cu Solder Joint Reinforced with ZrO2 Nanoparticles. Metals, 10 (10) 1295pp. doi:10.3390/met10101295
Yusof, Farazila, Muhamad, Mohd, Moshwan, Raza, Jamaludin, Mohd, Miyashita, Yukio (2016) Effect of Surface States on Joining Mechanisms and Mechanical Properties of Aluminum Alloy (A5052) and Polyethylene Terephthalate (PET) by Dissimilar Friction Spot Welding. Metals, 6 (5). 101pp. doi:10.3390/met6050101
Janasekaran, Shamini, Tan, Ai Wen, Yusof, Farazila, Abdul Shukor, Mohd Hamdi (2016) Feasibility Study of Low Power Fiber Laser Welding AA2024 and AA7075 Alloys T-Joint. Key Engineering Materials, 701. 182-186 doi:10.4028/www.scientific.net/kem.701.182
Gao, Feng, Cheng, Fangjie, Nishikawa, Hiroshi, Takemoto, Tadashi (2008) Characterization of Co–Sn intermetallic compounds in Sn–3.0Ag–0.5Cu–0.5Co lead-free solder alloy. Materials Letters, 62. 2257-2259 doi:10.1016/j.matlet.2007.11.060
Zaharinie, T., Yusof, Farazila, Abdul Shukor, Mohd Hamdi, Ariga, T. (2011) A Study on Interfacial Reaction and Titanium Distribution in Brazing Sapphire to Inconel 600 Using Cu/Ni Porous Composite. Advanced Materials Research, 383. 898-902 doi:10.4028/www.scientific.net/amr.383-390.898
Tan, Ai Ting, Tan, Ai Wen, Yusof, Farazila (2017) Evolution of microstructure and mechanical properties of Cu/SAC305/Cu solder joints under the influence of low ultrasonic power. Journal of Alloys and Compounds, 705. 188-197 doi:10.1016/j.jallcom.2017.02.165
Cheng, Fangjie, Gao, Feng, Nishikawa, Hiroshi, Takemoto, Tadashi (2009) Interaction behavior between the additives and Sn in Sn–3.0Ag–0.5Cu-based solder alloys and the relevant joint solderability. Journal of Alloys and Compounds, 472. 530-534 doi:10.1016/j.jallcom.2008.05.017
 
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