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Yoon, Jeong Won, Jung, Seung Boo (2006) TEM Observation of Interfacial Reaction Layers Formed Between Pb(Lead)-Free Sn-3.5Ag Solder and ENIG Plated Cu Substrate. Materials Science Forum, 510. 554-557 doi:10.4028/www.scientific.net/msf.510-511.554

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Reference TypeJournal (article/letter/editorial)
TitleTEM Observation of Interfacial Reaction Layers Formed Between Pb(Lead)-Free Sn-3.5Ag Solder and ENIG Plated Cu Substrate
JournalMaterials Science Forum
AuthorsYoon, Jeong WonAuthor
Jung, Seung BooAuthor
Year2006 (March)Volume510
PublisherTrans Tech Publications, Ltd.
DOIdoi:10.4028/www.scientific.net/msf.510-511.554Search in ResearchGate
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Mindat Ref. ID9860197Long-form Identifiermindat:1:5:9860197:0
GUID0
Full ReferenceYoon, Jeong Won, Jung, Seung Boo (2006) TEM Observation of Interfacial Reaction Layers Formed Between Pb(Lead)-Free Sn-3.5Ag Solder and ENIG Plated Cu Substrate. Materials Science Forum, 510. 554-557 doi:10.4028/www.scientific.net/msf.510-511.554
Plain TextYoon, Jeong Won, Jung, Seung Boo (2006) TEM Observation of Interfacial Reaction Layers Formed Between Pb(Lead)-Free Sn-3.5Ag Solder and ENIG Plated Cu Substrate. Materials Science Forum, 510. 554-557 doi:10.4028/www.scientific.net/msf.510-511.554
In(2006) Materials Science Forum Vol. 510. Trans Tech Publications, Ltd.

See Also

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Yoon, Jeong Won, Kim, Sang Won, Jung, Seung Boo (2005) Interfacial Reaction and Shear Strength of Pb-Free Sn-3.5Ag/Ni BGA Solder Joints during Reflow. Materials Science Forum, 486. 289-292 doi:10.4028/www.scientific.net/msf.486-487.289
Yoon, Jeong Won, Jung, Seung Boo (2006) Interfacial Reaction of Cu/Sn-Ag/ENIG Sandwich Solder Joint during Aging. Advanced Materials Research, 15. 1001-1007 doi:10.4028/www.scientific.net/amr.15-17.1001
Yoon, Jeong Won, Lee, Chang Bae, Jung, Seung Boo (2004) Growth Kinetics of IMC Formed between Sn-3.5Ag-0.75Cu BGA Solder and Electroless Ni-P/Cu Substrate by Solid-State Isothermal Aging. Materials Science Forum, 449. 893-896 doi:10.4028/www.scientific.net/msf.449-452.893
Kim, Dae Gon, Ha, Sang Su, Jung, Seung Boo (2006) Interfacial Reaction and Joint Strength on Cu UBM with Pb-Free Flip Chip Solder Bumps. Materials Science Forum, 510. 550-553 doi:10.4028/www.scientific.net/msf.510-511.550
Yoon, Jeong-Won, Chun, Hyun-Suk, Jung, Seung-Boo (2008) Correlation between interfacial reactions and shear strengths of Sn-Ag-(Cu and Bi-In)/ENIG plated Cu solder joints. Materials Science and Engineering: A, 483. 731-734 doi:10.1016/j.msea.2006.09.162
Kang, Han-Byul, Lee, Jae-Wook, Bae, Jee-Hwan, Park, Min-Ho, Yoon, Jeong-Won, Jung, Seung-Boo, Ju, Jae-Seon, Yang, Cheol-Woong (2008) Initial interfacial reaction layers formed in Sn–3.5Ag solder/electroless Ni–P plated Cu substrate system. Journal of Materials Research, 23 (8) 2195-2201 doi:10.1557/jmr.2008.0266
Yoon, Jeong-Won, Jung, Seung-Boo (2005) Interfacial reactions between Sn–0.4Cu solder and Cu substrate with or without ENIG plating layer during reflow reaction. Journal of Alloys and Compounds, 396. 122-127 doi:10.1016/j.jallcom.2004.12.009
Kim, Jong Woong, Jung, Seung Boo (2006) Effects of Void Formation within the Pb-Free BGA Solder Balls on the Mechanical Joint Strength. Materials Science Forum, 510. 546-549 doi:10.4028/www.scientific.net/msf.510-511.546
Kim, Jong Woong, Yoon, Jeong Won, Jung, Seung Boo (2004) Influence of Shear Speed on the Shear Force of Eutectic Sn-Pb and Pb-Free BGA Solder Joints. Materials Science Forum, 449. 897-900 doi:10.4028/www.scientific.net/msf.449-452.897
Yoon, Jeong-Won, Kim, Sang-Won, Jung, Seung-Boo (2005) IMC morphology, interfacial reaction and joint reliability of Pb-free Sn–Ag–Cu solder on electrolytic Ni BGA substrate. Journal of Alloys and Compounds, 392. 247-252 doi:10.1016/j.jallcom.2004.09.045
Yoon, Jeong-Won, Jung, Seung-Boo (2004) Effect of isothermal aging on intermetallic compound layer growth at the interface between Sn-3.5Ag-0.75Cu solder and Cu substrate. Journal of Materials Science, 39. 4211-4217 doi:10.1023/b:jmsc.0000033401.38785.73
 
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