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An, Tong, Qin, Fei (2013) Intergranular cracking simulation of the intermetallic compound layer in solder joints. Computational Materials Science, 79. 1-14 doi:10.1016/j.commatsci.2013.05.044

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Reference TypeJournal (article/letter/editorial)
TitleIntergranular cracking simulation of the intermetallic compound layer in solder joints
JournalComputational Materials Science
AuthorsAn, TongAuthor
Qin, FeiAuthor
Year2013 (November)Volume79
PublisherElsevier BV
DOIdoi:10.1016/j.commatsci.2013.05.044Search in ResearchGate
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Mindat Ref. ID9507803Long-form Identifiermindat:1:5:9507803:8
GUID0
Full ReferenceAn, Tong, Qin, Fei (2013) Intergranular cracking simulation of the intermetallic compound layer in solder joints. Computational Materials Science, 79. 1-14 doi:10.1016/j.commatsci.2013.05.044
Plain TextAn, Tong, Qin, Fei (2013) Intergranular cracking simulation of the intermetallic compound layer in solder joints. Computational Materials Science, 79. 1-14 doi:10.1016/j.commatsci.2013.05.044
In(n.d.) Computational Materials Science Vol. 79. Elsevier BV

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Weinberg, Kerstin, Böhme, Thomas, Müller, Wolfgang H. (2009) Kirkendall voids in the intermetallic layers of solder joints in MEMS. Computational Materials Science, 45 (3). 827-831 doi:10.1016/j.commatsci.2008.09.028
AN, Tong, QIN, Fei, WANG, Xiaoliang (2013) MICROSTRUCTURE EVOLUTION AND MECHANICALBEHAVIOR OF INTERMETALLIC COMPOUNDSIN SOLDER JOINT. ACTA METALLURGICA SINICA, 49 (9). 1137pp. doi:10.3724/sp.j.1037.2013.00186
Yao, Wei, Basaran, Cemal (2013) Electromigration damage mechanics of lead-free solder joints under pulsed DC: A computational model. Computational Materials Science, 71. 76-88 doi:10.1016/j.commatsci.2013.01.016
Huang, Jiaqiang; Wang, Xudong; Pan, Zhiliang; Xiao, Dawei; Xiao, Hanfei; Liang, Caihang; Qin, Hongbo (2026) Current-induced polarity reversal of intermetallic compound growth in hybrid solder joints. Materials Letters, 408. doi:10.1016/j.matlet.2026.140108
Bordreuil, Cyril, Niel, Aurélie (2014) Modelling of hot cracking in welding with a cellular automaton combined with an intergranular fluid flow model. Computational Materials Science, 82. 442-450 doi:10.1016/j.commatsci.2013.09.067
Jivkov, A.P., Stevens, N.P.C., Marrow, T.J. (2006) A three-dimensional computational model for intergranular cracking. Computational Materials Science, 38 (2). 442-453 doi:10.1016/j.commatsci.2006.03.012
Gong, Jicheng, Liu, Changqing, Conway, Paul P., Silberschmidt, Vadim V. (2008) Mesomechanical modelling of SnAgCu solder joints in flip chip. Computational Materials Science, 43 (1). 199-211 doi:10.1016/j.commatsci.2007.07.039
Zhang, H., Lopez, H.F. (2013) Role of nanoceria coatings on the high temperature oxidation of stainless steels: An atomistic simulation. Computational Materials Science, 79. 634-638 doi:10.1016/j.commatsci.2013.07.043
Gräser, Carsten, Kornhuber, Ralf, Sack, Uli (2014) Numerical simulation of coarsening in binary solder alloys. Computational Materials Science, 93. 221-233 doi:10.1016/j.commatsci.2014.06.010
Pan, SuXin, Hu, YiFeng, Li, Qun (2013) Numerical simulation of mechanical properties in nanoporous membrane. Computational Materials Science, 79. 611-618 doi:10.1016/j.commatsci.2013.06.042
Menk, Alexander, Bordas, Stéphane P.A. (2011) Crack growth calculations in solder joints based on microstructural phenomena with X-FEM. Computational Materials Science, 50 (3). 1145-1156 doi:10.1016/j.commatsci.2010.11.014
 
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