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Gong, Jicheng, Liu, Changqing, Conway, Paul P., Silberschmidt, Vadim V. (2008) Mesomechanical modelling of SnAgCu solder joints in flip chip. Computational Materials Science, 43 (1). 199-211 doi:10.1016/j.commatsci.2007.07.039

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Reference TypeJournal (article/letter/editorial)
TitleMesomechanical modelling of SnAgCu solder joints in flip chip
JournalComputational Materials Science
AuthorsGong, JichengAuthor
Liu, ChangqingAuthor
Conway, Paul P.Author
Silberschmidt, Vadim V.Author
Year2008 (July)Volume43
Issue1
PublisherElsevier BV
DOIdoi:10.1016/j.commatsci.2007.07.039Search in ResearchGate
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Mindat Ref. ID9504985Long-form Identifiermindat:1:5:9504985:0
GUID0
Full ReferenceGong, Jicheng, Liu, Changqing, Conway, Paul P., Silberschmidt, Vadim V. (2008) Mesomechanical modelling of SnAgCu solder joints in flip chip. Computational Materials Science, 43 (1). 199-211 doi:10.1016/j.commatsci.2007.07.039
Plain TextGong, Jicheng, Liu, Changqing, Conway, Paul P., Silberschmidt, Vadim V. (2008) Mesomechanical modelling of SnAgCu solder joints in flip chip. Computational Materials Science, 43 (1). 199-211 doi:10.1016/j.commatsci.2007.07.039
In(2008, July) Computational Materials Science Vol. 43 (1) Elsevier BV

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Gong, Jicheng, Liu, Changqing, Conway, Paul P., Silberschmidt, Vadim V. (2007) Micromechanical modelling of SnAgCu solder joint under cyclic loading: Effect of grain orientation. Computational Materials Science, 39 (1). 187-197 doi:10.1016/j.commatsci.2006.02.020
Gong, Jicheng, Liu, Changqing, Conway, Paul P., Silberschmidt, Vadim V. (2010) Formation of Ag3Sn plates in SnAgCu solder bumps. Materials Science and Engineering: A, 527. 2588-2591 doi:10.1016/j.msea.2009.12.020
Gong, Jicheng, Liu, Changqing, Conway, Paul P., Silberschmidt, Vadim V. (2006) Modelling of Ag3Sn coarsening and its effect on creep of Sn–Ag eutectics. Materials Science and Engineering: A, 427. 60-68 doi:10.1016/j.msea.2006.04.034
Gong, J., Liu, C., Conway, P.P., Silberschmidt, Vadim V. (2006) Analysis of Stress Distribution in SnAgCu Solder Joint. Applied Mechanics and Materials, 5. 359-366 doi:10.4028/www.scientific.net/amm.5-6.359
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Li, Dezhi, Liu, Changqing, Conway, Paul P. (2005) Characteristics of intermetallics and micromechanical properties during thermal ageing of Sn–Ag–Cu flip-chip solder interconnects. Materials Science and Engineering: A, 391. 95-103 doi:10.1016/j.msea.2004.10.007
Silberschmidt, Vadim V., Schmauder, Siegfried (2012) Preface. Computational Materials Science, 52 (1). 1pp. doi:10.1016/j.commatsci.2011.07.047
Amalu, Emeka H., Ekere, N.N. (2012) Damage of lead-free solder joints in flip chip assemblies subjected to high-temperature thermal cycling. Computational Materials Science, 65. 470-484 doi:10.1016/j.commatsci.2012.08.005
Hegde, Pradeep, Ochana, Andrew R., Whalley, David. C., Silberschmidt, Vadim. V. (2008) Finite element analysis of lead-free surface mount devices. Computational Materials Science, 43 (1). 212-220 doi:10.1016/j.commatsci.2007.07.046
Liu, Changqing, Huang, Zhiheng, Conway, Paul P., Thomson, Rachel C. (2007) Materials behaviour and intermetallics characteristics in the reaction between SnAgCu and Sn–Pb solder alloys. Journal of Materials Science, 42. 4076-4086 doi:10.1007/s10853-006-1335-6
Zhao, Jian, Silberschmidt, Vadim V. (2005) Microstructure-based damage and fracture modelling of alumina coatings. Computational Materials Science, 32 (3). 620-628 doi:10.1016/j.commatsci.2004.09.001
 
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