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Gong, Jicheng, Liu, Changqing, Conway, Paul P., Silberschmidt, Vadim V. (2007) Micromechanical modelling of SnAgCu solder joint under cyclic loading: Effect of grain orientation. Computational Materials Science, 39 (1). 187-197 doi:10.1016/j.commatsci.2006.02.020

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Reference TypeJournal (article/letter/editorial)
TitleMicromechanical modelling of SnAgCu solder joint under cyclic loading: Effect of grain orientation
JournalComputational Materials Science
AuthorsGong, JichengAuthor
Liu, ChangqingAuthor
Conway, Paul P.Author
Silberschmidt, Vadim V.Author
Year2007 (March)Volume39
Issue1
PublisherElsevier BV
DOIdoi:10.1016/j.commatsci.2006.02.020Search in ResearchGate
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Mindat Ref. ID9504609Long-form Identifiermindat:1:5:9504609:3
GUID0
Full ReferenceGong, Jicheng, Liu, Changqing, Conway, Paul P., Silberschmidt, Vadim V. (2007) Micromechanical modelling of SnAgCu solder joint under cyclic loading: Effect of grain orientation. Computational Materials Science, 39 (1). 187-197 doi:10.1016/j.commatsci.2006.02.020
Plain TextGong, Jicheng, Liu, Changqing, Conway, Paul P., Silberschmidt, Vadim V. (2007) Micromechanical modelling of SnAgCu solder joint under cyclic loading: Effect of grain orientation. Computational Materials Science, 39 (1). 187-197 doi:10.1016/j.commatsci.2006.02.020
In(2007, March) Computational Materials Science Vol. 39 (1) Elsevier BV

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Gong, Jicheng, Liu, Changqing, Conway, Paul P., Silberschmidt, Vadim V. (2008) Mesomechanical modelling of SnAgCu solder joints in flip chip. Computational Materials Science, 43 (1). 199-211 doi:10.1016/j.commatsci.2007.07.039
Gong, Jicheng, Liu, Changqing, Conway, Paul P., Silberschmidt, Vadim V. (2010) Formation of Ag3Sn plates in SnAgCu solder bumps. Materials Science and Engineering: A, 527. 2588-2591 doi:10.1016/j.msea.2009.12.020
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Gong, J., Liu, C., Conway, P.P., Silberschmidt, Vadim V. (2006) Analysis of Stress Distribution in SnAgCu Solder Joint. Applied Mechanics and Materials, 5. 359-366 doi:10.4028/www.scientific.net/amm.5-6.359
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Liu, Changqing, Huang, Zhiheng, Conway, Paul P., Thomson, Rachel C. (2007) Materials behaviour and intermetallics characteristics in the reaction between SnAgCu and Sn–Pb solder alloys. Journal of Materials Science, 42. 4076-4086 doi:10.1007/s10853-006-1335-6
Silberschmidt, Vadim V., Schmauder, Siegfried (2012) Preface. Computational Materials Science, 52 (1). 1pp. doi:10.1016/j.commatsci.2011.07.047
Ullah, Himayat, Harland, Andy R., Silberschmidt, Vadim V. (2012) Damage modelling in woven-fabric CFRP laminates under large-deflection bending. Computational Materials Science, 64. 130-135 doi:10.1016/j.commatsci.2012.05.036
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Zhao, Jian, Silberschmidt, Vadim V. (2005) Microstructure-based damage and fracture modelling of alumina coatings. Computational Materials Science, 32 (3). 620-628 doi:10.1016/j.commatsci.2004.09.001
 
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