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Weinberg, Kerstin, Böhme, Thomas, Müller, Wolfgang H. (2009) Kirkendall voids in the intermetallic layers of solder joints in MEMS. Computational Materials Science, 45 (3). 827-831 doi:10.1016/j.commatsci.2008.09.028

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Reference TypeJournal (article/letter/editorial)
TitleKirkendall voids in the intermetallic layers of solder joints in MEMS
JournalComputational Materials Science
AuthorsWeinberg, KerstinAuthor
Böhme, ThomasAuthor
Müller, Wolfgang H.Author
Year2009 (May)Volume45
Issue3
PublisherElsevier BV
DOIdoi:10.1016/j.commatsci.2008.09.028Search in ResearchGate
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Mindat Ref. ID9505451Long-form Identifiermindat:1:5:9505451:5
GUID0
Full ReferenceWeinberg, Kerstin, Böhme, Thomas, Müller, Wolfgang H. (2009) Kirkendall voids in the intermetallic layers of solder joints in MEMS. Computational Materials Science, 45 (3). 827-831 doi:10.1016/j.commatsci.2008.09.028
Plain TextWeinberg, Kerstin, Böhme, Thomas, Müller, Wolfgang H. (2009) Kirkendall voids in the intermetallic layers of solder joints in MEMS. Computational Materials Science, 45 (3). 827-831 doi:10.1016/j.commatsci.2008.09.028
In(2009, May) Computational Materials Science Vol. 45 (3) Elsevier BV

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Böhme, Thomas, Müller, Wolfgang H., Weinberg, Kerstin (2009) Numerical modeling of diffusion induced phase transformations in mechanically stressed lead-free alloys. Computational Materials Science, 45 (3). 837-844 doi:10.1016/j.commatsci.2008.08.015
Böhme, Thomas, Müller, Wolfgang H. (2008) Theoretical and experimental investigations of microstructural changes in lead-free solders. Computational Materials Science, 43 (1). 221-228 doi:10.1016/j.commatsci.2007.07.034
Böhme, Thomas, Müller, Wolfgang H. (2007) On the simulation of the spinodal decomposition process and phase growth in a leadfree brazing material. Computational Materials Science, 39 (1). 166-171 doi:10.1016/j.commatsci.2006.01.027
An, Tong, Qin, Fei (2013) Intergranular cracking simulation of the intermetallic compound layer in solder joints. Computational Materials Science, 79. 1-14 doi:10.1016/j.commatsci.2013.05.044
Alam, M.O., Lu, H., Bailey, Chris, Chan, Y.C. (2009) Fracture mechanics analysis of solder joint intermetallic compounds in shear test. Computational Materials Science, 45 (2). 576-583 doi:10.1016/j.commatsci.2008.12.001
Kim, S.H., Yu, Jin (2013) Heat-treatment to suppress the formation of Kirkendall voids in Sn-3.5Ag/Cu solder joints. Materials Letters, 106. 75-78 doi:10.1016/j.matlet.2013.05.019
Derewońko, Agnieszka (2009) Prediction of the failure metal/composite bonded joints. Computational Materials Science, 45 (3). 735-738 doi:10.1016/j.commatsci.2008.07.018
Anders, Denis, Weinberg, Kerstin, Reichardt, Roland (2012) Isogeometric analysis of thermal diffusion in binary blends. Computational Materials Science, 52 (1). 182-188 doi:10.1016/j.commatsci.2011.01.008
Menk, Alexander, Bordas, Stéphane P.A. (2011) Crack growth calculations in solder joints based on microstructural phenomena with X-FEM. Computational Materials Science, 50 (3). 1145-1156 doi:10.1016/j.commatsci.2010.11.014
Amalu, Emeka H., Ekere, N.N. (2012) Damage of lead-free solder joints in flip chip assemblies subjected to high-temperature thermal cycling. Computational Materials Science, 65. 470-484 doi:10.1016/j.commatsci.2012.08.005
Anders, Denis, Weinberg, Kerstin (2011) Numerical simulation of diffusion induced phase separation and coarsening in binary alloys. Computational Materials Science, 50 (4). 1359-1364 doi:10.1016/j.commatsci.2010.03.030
 
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