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Böhme, Thomas, Müller, Wolfgang H. (2008) Theoretical and experimental investigations of microstructural changes in lead-free solders. Computational Materials Science, 43 (1). 221-228 doi:10.1016/j.commatsci.2007.07.034

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Reference TypeJournal (article/letter/editorial)
TitleTheoretical and experimental investigations of microstructural changes in lead-free solders
JournalComputational Materials Science
AuthorsBöhme, ThomasAuthor
Müller, Wolfgang H.Author
Year2008 (July)Volume43
Issue1
PublisherElsevier BV
DOIdoi:10.1016/j.commatsci.2007.07.034Search in ResearchGate
Generate Citation Formats
Mindat Ref. ID9504980Long-form Identifiermindat:1:5:9504980:5
GUID0
Full ReferenceBöhme, Thomas, Müller, Wolfgang H. (2008) Theoretical and experimental investigations of microstructural changes in lead-free solders. Computational Materials Science, 43 (1). 221-228 doi:10.1016/j.commatsci.2007.07.034
Plain TextBöhme, Thomas, Müller, Wolfgang H. (2008) Theoretical and experimental investigations of microstructural changes in lead-free solders. Computational Materials Science, 43 (1). 221-228 doi:10.1016/j.commatsci.2007.07.034
In(2008, July) Computational Materials Science Vol. 43 (1) Elsevier BV

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Böhme, Thomas, Müller, Wolfgang H., Weinberg, Kerstin (2009) Numerical modeling of diffusion induced phase transformations in mechanically stressed lead-free alloys. Computational Materials Science, 45 (3). 837-844 doi:10.1016/j.commatsci.2008.08.015
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Cheng, Fangjie, Nishikawa, Hiroshi, Takemoto, Tadashi (2008) Microstructural and mechanical properties of Sn–Ag–Cu lead-free solders with minor addition of Ni and/or Co. Journal of Materials Science, 43. 3643-3648 doi:10.1007/s10853-008-2580-7
de Borst, René (2008) Challenges in computational materials science: Multiple scales, multi-physics and evolving discontinuities. Computational Materials Science, 43 (1). 1-15 doi:10.1016/j.commatsci.2007.07.022
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Liebold, Christian, Müller, Wolfgang H. (2016) Comparison of gradient elasticity models for the bending of micromaterials. Computational Materials Science, 116. 52-61 doi:10.1016/j.commatsci.2015.10.031
 
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