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Etschmaier, Harald, Novák, Jiří, Eder, Hannes, Hadley, Peter (2012) Reaction dynamics of diffusion soldering with the eutectic Au–Sn alloy on copper and silver substrates. Intermetallics, 20 (1). 87-92 doi:10.1016/j.intermet.2011.08.014

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Reference TypeJournal (article/letter/editorial)
TitleReaction dynamics of diffusion soldering with the eutectic Au–Sn alloy on copper and silver substrates
JournalIntermetallics
AuthorsEtschmaier, HaraldAuthor
Novák, JiříAuthor
Eder, HannesAuthor
Hadley, PeterAuthor
Year2012 (January)Volume20
Issue1
PublisherElsevier BV
DOIdoi:10.1016/j.intermet.2011.08.014Search in ResearchGate
Generate Citation Formats
Mindat Ref. ID7967992Long-form Identifiermindat:1:5:7967992:5
GUID0
Full ReferenceEtschmaier, Harald, Novák, Jiří, Eder, Hannes, Hadley, Peter (2012) Reaction dynamics of diffusion soldering with the eutectic Au–Sn alloy on copper and silver substrates. Intermetallics, 20 (1). 87-92 doi:10.1016/j.intermet.2011.08.014
Plain TextEtschmaier, Harald, Novák, Jiří, Eder, Hannes, Hadley, Peter (2012) Reaction dynamics of diffusion soldering with the eutectic Au–Sn alloy on copper and silver substrates. Intermetallics, 20 (1). 87-92 doi:10.1016/j.intermet.2011.08.014
In(2012, January) Intermetallics Vol. 20 (1) Elsevier BV

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O, Minho, Tanaka, Yuki, Kobayashi, Equo (2023) Growth behavior of intermetallic layers at the interface between Cu and eutectic Sn–Bi by grain boundary diffusion with the grain growth at solid-state temperatures. Intermetallics, 161. 107986 doi:10.1016/j.intermet.2023.107986
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