登录注册
Quick Links : Mindat手册The Rock H. Currier Digital LibraryMindat Newsletter [Free Download]
主页关于 MindatMindat手册Mindat的历史版权Who We Are联系我们于 Mindat.org刊登广告
捐赠给 MindatCorporate Sponsorship赞助板页已赞助的板页在 Mindat刊登 广告的广告商于 Mindat.org刊登广告
Learning CenterWhat is a mineral?The most common minerals on earthInformation for EducatorsMindat ArticlesThe ElementsThe Rock H. Currier Digital LibraryGeologic Time
搜索矿物的性质搜索矿物的化学Mineral Visual ExplorerAdvanced Locality Search随意显示任何一 种矿物Random Locality使用minID搜索邻近产地Search Articles搜索词汇表更多搜索选项
搜索:
矿物名称:
地区产地名称:
关键字:
 
Mindat手册添加新照片Rate Photos产区编辑报告Coordinate Completion Report添加词汇表项目
Mining Companies统计会员列表Mineral MuseumsClubs & Organizations矿物展及活动The Mindat目录表设备设置The Mineral QuizTime Machine
照片搜索Photo GalleriesSearch by ColorPhoto Colour Explorer今天最新的照片昨天最新的照片用户照片相集过去每日精选照片相集Photography

Gollas, Bernhard, Albering, Jörg H., Schmut, Katharina, Pointner, Volker, Herber, Ralph, Etzkorn, Johannes (2008) Thin layer in situ XRD of electrodeposited Ag/Sn and Ag/In for low-temperature isothermal diffusion soldering. Intermetallics, 16 (8). 962-968 doi:10.1016/j.intermet.2008.04.014

Advanced
   -   Only viewable:
Reference TypeJournal (article/letter/editorial)
TitleThin layer in situ XRD of electrodeposited Ag/Sn and Ag/In for low-temperature isothermal diffusion soldering
JournalIntermetallics
AuthorsGollas, BernhardAuthor
Albering, Jörg H.Author
Schmut, KatharinaAuthor
Pointner, VolkerAuthor
Herber, RalphAuthor
Etzkorn, JohannesAuthor
Year2008 (August)Volume16
Issue8
PublisherElsevier BV
DOIdoi:10.1016/j.intermet.2008.04.014Search in ResearchGate
Generate Citation Formats
Mindat Ref. ID7966065Long-form Identifiermindat:1:5:7966065:3
GUID0
Full ReferenceGollas, Bernhard, Albering, Jörg H., Schmut, Katharina, Pointner, Volker, Herber, Ralph, Etzkorn, Johannes (2008) Thin layer in situ XRD of electrodeposited Ag/Sn and Ag/In for low-temperature isothermal diffusion soldering. Intermetallics, 16 (8). 962-968 doi:10.1016/j.intermet.2008.04.014
Plain TextGollas, Bernhard, Albering, Jörg H., Schmut, Katharina, Pointner, Volker, Herber, Ralph, Etzkorn, Johannes (2008) Thin layer in situ XRD of electrodeposited Ag/Sn and Ag/In for low-temperature isothermal diffusion soldering. Intermetallics, 16 (8). 962-968 doi:10.1016/j.intermet.2008.04.014
In(2008, August) Intermetallics Vol. 16 (8) Elsevier BV

See Also

These are possibly similar items as determined by title/reference text matching only.

Jao, Chien-Chung, Yen, Yee-Wen, Lin, Chung-Yung, Lee, Chiapyng (2008) Phase equilibria of the Sn–Zn–Ag system and interfacial reactions in Sn–Zn/Ag couples. Intermetallics, 16 (3). 463-469 doi:10.1016/j.intermet.2007.12.007
Shen, J., Chan, Y.C., Liu, S.Y. (2008) Growth mechanism of bulk Ag3Sn intermetallic compounds in Sn–Ag solder during solidification. Intermetallics, 16 (9). 1142-1148 doi:10.1016/j.intermet.2008.06.016
Lin, Chung-Yung, Lee, Chiapyng, Liu, Xingjun, Yen, Yee-Wen (2008) Phase equilibria of the Sn–Sb–Ag ternary system and interfacial reactions at the Sn–Sb/Ag joints at 400°C and 150°C. Intermetallics, 16 (2). 230-238 doi:10.1016/j.intermet.2007.10.002
Celik, F.A., Kazanc, S., Yildiz, A.K., Ozgen, S. (2008) Pressure effect on the structural properties of amorphous Ag during isothermal annealing. Intermetallics, 16 (6). 793-800 doi:10.1016/j.intermet.2008.03.002
Elmahfoudi, A., Sabbar, A., Flandorfer, H. (2012) Enthalpies of mixing of liquid systems for lead free soldering: Co–Sb–Sn. Intermetallics, 23. 128-133 doi:10.1016/j.intermet.2011.12.023
Hu, Zhan-Shuo, Hung, Fei-Yi, Chang, Shoou-Jinn, Chen, Kuan-Jen, Chen, Yue-Zhang (2010) Crystallization effect of Al–Ag alloying layer in PL enhancement of ZnO thin film. Intermetallics, 18 (8). 1428-1431 doi:10.1016/j.intermet.2010.03.020
Lejuste, Charles, Hodaj, Fiqiri, Petit, Luc (2013) Solid state interaction between a Sn–Ag–Cu–In solder alloy and Cu substrate. Intermetallics, 36. 102-108 doi:10.1016/j.intermet.2012.12.020
Etschmaier, Harald, Novák, Jiří, Eder, Hannes, Hadley, Peter (2012) Reaction dynamics of diffusion soldering with the eutectic Au–Sn alloy on copper and silver substrates. Intermetallics, 20 (1). 87-92 doi:10.1016/j.intermet.2011.08.014
Choux, C., Kulińska, A.J., Chevalier, S. (2008) High temperature reactivity of nickel aluminide diffusion coatings. Intermetallics, 16 (1). 1-9 doi:10.1016/j.intermet.2007.07.014
Teo, J.W. Ronnie (2008) Microstructure and failure mode of Sn–37Pb soldered in laser diode packages. Intermetallics, 16 (2). 293-298 doi:10.1016/j.intermet.2007.10.009
Yu, Chi-Yang, Chen, Wei-Yu, Duh, Jenq-Gong (2012) Suppressing the growth of Cu–Sn intermetallic compounds in Ni/Sn–Ag–Cu/Cu–Zn solder joints during thermal aging. Intermetallics, 26. 11-17 doi:10.1016/j.intermet.2012.03.046
 
and/or  
版权所有© mindat.org1993年至2026年，除了规定的地方。 Mindat.org全赖于全球数千个以上成员和支持者们的参与。
To cite: Ralph, J., Von Bargen, D., Martynov, P., Zhang, J., Que, X., Prabhu, A., Morrison, S. M., Li, W., Chen, W., & Ma, X. (2025). Mindat.org: The open access mineralogy database to accelerate data-intensive geoscience research. American Mineralogist, 110(6), 833–844. doi:10.2138/am-2024-9486.
隐私政策 - 条款和条款细则 - 联络我们 - Report a bug/vulnerability Current server date and time: 2026.6.7 11:26:47
Go to top of page