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Yang, Ming, Li, Mingyu, Wang, Chunqing (2012) Interfacial reactions of eutectic Sn3.5Ag and pure tin solders with Cu substrates during liquid-state soldering. Intermetallics, 25. 86-94 doi:10.1016/j.intermet.2012.02.023

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Reference TypeJournal (article/letter/editorial)
TitleInterfacial reactions of eutectic Sn3.5Ag and pure tin solders with Cu substrates during liquid-state soldering
JournalIntermetallics
AuthorsYang, MingAuthor
Li, MingyuAuthor
Wang, ChunqingAuthor
Year2012 (June)Volume25
PublisherElsevier BV
DOIdoi:10.1016/j.intermet.2012.02.023Search in ResearchGate
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Mindat Ref. ID7968293Long-form Identifiermindat:1:5:7968293:8
GUID0
Full ReferenceYang, Ming, Li, Mingyu, Wang, Chunqing (2012) Interfacial reactions of eutectic Sn3.5Ag and pure tin solders with Cu substrates during liquid-state soldering. Intermetallics, 25. 86-94 doi:10.1016/j.intermet.2012.02.023
Plain TextYang, Ming, Li, Mingyu, Wang, Chunqing (2012) Interfacial reactions of eutectic Sn3.5Ag and pure tin solders with Cu substrates during liquid-state soldering. Intermetallics, 25. 86-94 doi:10.1016/j.intermet.2012.02.023
In(n.d.) Intermetallics Vol. 25. Elsevier BV

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Yang, Ming, Chen, Hongtao, Ma, Xin, Li, Mingyu, Cao, Yong, Kim, Jongmyung (2014) Solid-state interfacial reaction of eutectic Sn3.5Ag and pure tin solders with polycrystalline Cu substrate. Journal of Materials Science, 49. 3652-3664 doi:10.1007/s10853-014-8069-7
Yang, Ming, Ji, Hongjun, Wang, Shuai, Ko, Yong-Ho, Lee, Chang-Woo, Wu, Jianxin, Li, Mingyu (2016) Effects of Ag content on the interfacial reactions between liquid Sn–Ag–Cu solders and Cu substrates during soldering. Journal of Alloys and Compounds, 679. 18-25 doi:10.1016/j.jallcom.2016.03.177
Yang, Ming, Li, Mingyu, Kim, Jongmyung (2012) Texture evolution and its effects on growth of intermetallic compounds formed at eutectic Sn37Pb/Cu interface during solid-state aging. Intermetallics, 31. 177-185 doi:10.1016/j.intermet.2012.07.004
Wang, Chao-hong, Shen, Han-ting (2010) Effects of Ni addition on the interfacial reactions between Sn–Cu solders and Ni substrate. Intermetallics, 18 (4). 616-622 doi:10.1016/j.intermet.2009.10.018
Li, Mingyu, Yang, Ming, Kim, Jongmyung (2012) Textured growth of Cu6Sn5 grains formed at a Sn3.5Ag/Cu interface. Materials Letters, 66. 135-137 doi:10.1016/j.matlet.2011.08.014
Etschmaier, Harald, Novák, Jiří, Eder, Hannes, Hadley, Peter (2012) Reaction dynamics of diffusion soldering with the eutectic Au–Sn alloy on copper and silver substrates. Intermetallics, 20 (1). 87-92 doi:10.1016/j.intermet.2011.08.014
Shen, Yu-An, Yang, Xiu-Mei, Tsai, Cheng-Yu, Ouyang, Yu-Hung, Tsai, Ming-Hung, Shun, Tao-Tsung (2022) Effect of Cu on the interfacial reaction between Sn-based solders and FeCoNiCu alloys. Intermetallics, 144. 107530pp. doi:10.1016/j.intermet.2022.107530
Xiao, Jinqing, Wang, Fuliang, Li, Junhui, Chen, Zhuo (2023) Comparison of interfacial reactions and isothermal aging of cone Ni-P and flat Ni-P with Sn3.5Ag solders. Applied Surface Science, 625. 157219 doi:10.1016/j.apsusc.2023.157219
Zhang, Zhihao, Li, Mingyu, Wang, Chunqing (2013) Fabrication of Cu6Sn5 single-crystal layer for under-bump metallization in flip-chip packaging. Intermetallics, 42. 52-55 doi:10.1016/j.intermet.2013.05.005
Wang, Chao-hong, Kuo, Chun-yi, Huang, Sheng-en, Li, Po-yi (2013) Temperature effects on liquid-state Sn/Co interfacial reactions. Intermetallics, 32. 57-63 doi:10.1016/j.intermet.2012.07.029
Yang, Ming, Li, Mingyu, Wang, Ling, Fu, Yonggao, Kim, Jongmyung, Weng, Lvqian (2011) Growth behavior of Cu6Sn5 grains formed at an Sn3.5Ag/Cu interface. Materials Letters, 65. 1506-1509 doi:10.1016/j.matlet.2011.02.056
 
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