| Reference Type | Journal (article/letter/editorial) |
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| Title | Mechanical Properties of Flip-Chip Solder Joints Effected by Electromigration |
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| Journal | Advanced Materials Research |
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| Authors | Lu, Yu Dong | Author |
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| En, Yun Fei | Author |
| Wan, Ming | Author |
| He, Xiao Qi | Author |
| Wang, Xin | Author |
| Year | 2011 (February) | Volume | 189 |
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| Publisher | Trans Tech Publications, Ltd. |
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| DOI | doi:10.4028/www.scientific.net/amr.189-193.1009Search in ResearchGate |
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| Generate Citation Formats |
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| Mindat Ref. ID | 11635320 | Long-form Identifier | mindat:1:5:11635320:9 |
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|
| GUID | 0 |
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| Full Reference | Lu, Yu Dong, En, Yun Fei, Wan, Ming, He, Xiao Qi, Wang, Xin (2011) Mechanical Properties of Flip-Chip Solder Joints Effected by Electromigration. Advanced Materials Research, 189. 1009-1013 doi:10.4028/www.scientific.net/amr.189-193.1009 |
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| Plain Text | Lu, Yu Dong, En, Yun Fei, Wan, Ming, He, Xiao Qi, Wang, Xin (2011) Mechanical Properties of Flip-Chip Solder Joints Effected by Electromigration. Advanced Materials Research, 189. 1009-1013 doi:10.4028/www.scientific.net/amr.189-193.1009 |
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| In | (n.d.) Advanced Materials Research Vol. 189. Trans Tech Publications, Ltd. |
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