| Reference Type | Journal (article/letter/editorial) |
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| Title | Failure Mechanism of Electromigration in Solder Joint |
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| Journal | Advanced Materials Research |
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| Authors | Lu, Yu Dong | Author |
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| He, Xiao Qi | Author |
| En, Yun Fei | Author |
| Wang, Xin | Author |
| Year | 2008 (June) | Volume | 44 |
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| Publisher | Trans Tech Publications, Ltd. |
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| DOI | doi:10.4028/www.scientific.net/amr.44-46.905Search in ResearchGate |
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| Generate Citation Formats |
| Mindat Ref. ID | 11621241 | Long-form Identifier | mindat:1:5:11621241:4 |
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| GUID | 0 |
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| Full Reference | Lu, Yu Dong, He, Xiao Qi, En, Yun Fei, Wang, Xin (2008) Failure Mechanism of Electromigration in Solder Joint. Advanced Materials Research, 44. 905-910 doi:10.4028/www.scientific.net/amr.44-46.905 |
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| Plain Text | Lu, Yu Dong, He, Xiao Qi, En, Yun Fei, Wang, Xin (2008) Failure Mechanism of Electromigration in Solder Joint. Advanced Materials Research, 44. 905-910 doi:10.4028/www.scientific.net/amr.44-46.905 |
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| In | (n.d.) Advanced Materials Research Vol. 44. Trans Tech Publications, Ltd. |
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