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Yan, Hai Dong, Zhou, De Jian, Zhao, Qiang (2011) Solder Joints Reliability Assessment for Stacked CSP Module Based on Flexible Circuit Printed Board. Advanced Materials Research, 189. 2125-2128 doi:10.4028/www.scientific.net/amr.189-193.2125

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Reference TypeJournal (article/letter/editorial)
TitleSolder Joints Reliability Assessment for Stacked CSP Module Based on Flexible Circuit Printed Board
JournalAdvanced Materials Research
AuthorsYan, Hai DongAuthor
Zhou, De JianAuthor
Zhao, QiangAuthor
Year2011 (February)Volume189
PublisherTrans Tech Publications, Ltd.
DOIdoi:10.4028/www.scientific.net/amr.189-193.2125Search in ResearchGate
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Mindat Ref. ID11635567Long-form Identifiermindat:1:5:11635567:8
GUID0
Full ReferenceYan, Hai Dong, Zhou, De Jian, Zhao, Qiang (2011) Solder Joints Reliability Assessment for Stacked CSP Module Based on Flexible Circuit Printed Board. Advanced Materials Research, 189. 2125-2128 doi:10.4028/www.scientific.net/amr.189-193.2125
Plain TextYan, Hai Dong, Zhou, De Jian, Zhao, Qiang (2011) Solder Joints Reliability Assessment for Stacked CSP Module Based on Flexible Circuit Printed Board. Advanced Materials Research, 189. 2125-2128 doi:10.4028/www.scientific.net/amr.189-193.2125
In(n.d.) Advanced Materials Research Vol. 189. Trans Tech Publications, Ltd.

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