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Niu, R. M., Liu, G., Wang, C., Zhang, G., Ding, X. D., Sun, J. (2007) Thickness dependent critical strain in submicron Cu films adherent to polymer substrate. Applied Physics Letters, 90 (16). 161907pp. doi:10.1063/1.2722684

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Reference TypeJournal (article/letter/editorial)
TitleThickness dependent critical strain in submicron Cu films adherent to polymer substrate
JournalApplied Physics Letters
AuthorsNiu, R. M.Author
Liu, G.Author
Wang, C.Author
Zhang, G.Author
Ding, X. D.Author
Sun, J.Author
Year2007 (April 16)Volume90
Issue16
PublisherAIP Publishing
DOIdoi:10.1063/1.2722684Search in ResearchGate
Generate Citation Formats
Mindat Ref. ID8553466Long-form Identifiermindat:1:5:8553466:9
GUID0
Full ReferenceNiu, R. M., Liu, G., Wang, C., Zhang, G., Ding, X. D., Sun, J. (2007) Thickness dependent critical strain in submicron Cu films adherent to polymer substrate. Applied Physics Letters, 90 (16). 161907pp. doi:10.1063/1.2722684
Plain TextNiu, R. M., Liu, G., Wang, C., Zhang, G., Ding, X. D., Sun, J. (2007) Thickness dependent critical strain in submicron Cu films adherent to polymer substrate. Applied Physics Letters, 90 (16). 161907pp. doi:10.1063/1.2722684
In(2007, April) Applied Physics Letters Vol. 90 (16) AIP Publishing

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