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Niu, R. M., Zhang, J., Wang, Z. J., Liu, G., Zhang, G. J., Ding, X. D., Sun, J. (2009) Mechanical strength lowering in submicron Cu thin films by moderate DC current. Applied Physics A, 97. 369-374 doi:10.1007/s00339-009-5218-y

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Reference TypeJournal (article/letter/editorial)
TitleMechanical strength lowering in submicron Cu thin films by moderate DC current
JournalApplied Physics A
AuthorsNiu, R. M.Author
Zhang, J.Author
Wang, Z. J.Author
Liu, G.Author
Zhang, G. J.Author
Ding, X. D.Author
Sun, J.Author
Year2009 (November)Volume97
PublisherSpringer Science and Business Media LLC
DOIdoi:10.1007/s00339-009-5218-ySearch in ResearchGate
Generate Citation Formats
Mindat Ref. ID6014154Long-form Identifiermindat:1:5:6014154:5
GUID0
Full ReferenceNiu, R. M., Zhang, J., Wang, Z. J., Liu, G., Zhang, G. J., Ding, X. D., Sun, J. (2009) Mechanical strength lowering in submicron Cu thin films by moderate DC current. Applied Physics A, 97. 369-374 doi:10.1007/s00339-009-5218-y
Plain TextNiu, R. M., Zhang, J., Wang, Z. J., Liu, G., Zhang, G. J., Ding, X. D., Sun, J. (2009) Mechanical strength lowering in submicron Cu thin films by moderate DC current. Applied Physics A, 97. 369-374 doi:10.1007/s00339-009-5218-y
In(2009) Applied Physics A Vol. 97. Springer Science and Business Media LLC

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