Chen, P. H., Lin, C. L., Liu, C. Y. (2007) Amorphous Si∕Au wafer bonding. Applied Physics Letters, 90 (13). 132120pp. doi:10.1063/1.2719025
| Reference Type | Journal (article/letter/editorial) | ||
|---|---|---|---|
| Title | Amorphous Si∕Au wafer bonding | ||
| Journal | Applied Physics Letters | ||
| Authors | Chen, P. H. | Author | |
| Lin, C. L. | Author | ||
| Liu, C. Y. | Author | ||
| Year | 2007 (March 26) | Volume | 90 |
| Issue | 13 | ||
| Publisher | AIP Publishing | ||
| DOI | doi:10.1063/1.2719025Search in ResearchGate | ||
| Generate Citation Formats | |||
| Mindat Ref. ID | 8553182 | Long-form Identifier | mindat:1:5:8553182:0 |
| GUID | 0 | ||
| Full Reference | Chen, P. H., Lin, C. L., Liu, C. Y. (2007) Amorphous Si∕Au wafer bonding. Applied Physics Letters, 90 (13). 132120pp. doi:10.1063/1.2719025 | ||
| Plain Text | Chen, P. H., Lin, C. L., Liu, C. Y. (2007) Amorphous Si∕Au wafer bonding. Applied Physics Letters, 90 (13). 132120pp. doi:10.1063/1.2719025 | ||
| In | (2007, March) Applied Physics Letters Vol. 90 (13) AIP Publishing | ||
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