Choi, Eunmi, Choi, Hee Soo, Kim, Areum, Lee, Seon Jea, Cui, Yinhua, Kwon, Soon hyeong, Kim, Chang Hyun, Hahn, Sang June, Son, Hyungbin, Pyo, Sung Gyu (2013) Measurement of adhesion and bonding strength studies in 3D interconnect structures using atomic force microscopy. Metals and Materials International, 19. 1339-1342 doi:10.1007/s12540-013-0636-y
| Reference Type | Journal (article/letter/editorial) | ||
|---|---|---|---|
| Title | Measurement of adhesion and bonding strength studies in 3D interconnect structures using atomic force microscopy | ||
| Journal | Metals and Materials International | ||
| Authors | Choi, Eunmi | Author | |
| Choi, Hee Soo | Author | ||
| Kim, Areum | Author | ||
| Lee, Seon Jea | Author | ||
| Cui, Yinhua | Author | ||
| Kwon, Soon hyeong | Author | ||
| Kim, Chang Hyun | Author | ||
| Hahn, Sang June | Author | ||
| Son, Hyungbin | Author | ||
| Pyo, Sung Gyu | Author | ||
| Year | 2013 (November) | Volume | 19 |
| Publisher | Springer Science and Business Media LLC | ||
| DOI | doi:10.1007/s12540-013-0636-ySearch in ResearchGate | ||
| Generate Citation Formats | |||
| Mindat Ref. ID | 8029281 | Long-form Identifier | mindat:1:5:8029281:0 |
| GUID | 0 | ||
| Full Reference | Choi, Eunmi, Choi, Hee Soo, Kim, Areum, Lee, Seon Jea, Cui, Yinhua, Kwon, Soon hyeong, Kim, Chang Hyun, Hahn, Sang June, Son, Hyungbin, Pyo, Sung Gyu (2013) Measurement of adhesion and bonding strength studies in 3D interconnect structures using atomic force microscopy. Metals and Materials International, 19. 1339-1342 doi:10.1007/s12540-013-0636-y | ||
| Plain Text | Choi, Eunmi, Choi, Hee Soo, Kim, Areum, Lee, Seon Jea, Cui, Yinhua, Kwon, Soon hyeong, Kim, Chang Hyun, Hahn, Sang June, Son, Hyungbin, Pyo, Sung Gyu (2013) Measurement of adhesion and bonding strength studies in 3D interconnect structures using atomic force microscopy. Metals and Materials International, 19. 1339-1342 doi:10.1007/s12540-013-0636-y | ||
| In | (n.d.) Metals and Materials International Vol. 19. Springer Science and Business Media LLC | ||
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