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Lin, Yong Cheng, Lu, Jing Hong, Zhang, Jun (2010) Numerical Simulation for the Thermal Fatigue of Flip Chip Solder Joints. Advanced Materials Research, 97. 3963-3966 doi:10.4028/www.scientific.net/amr.97-101.3963

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Reference TypeJournal (article/letter/editorial)
TitleNumerical Simulation for the Thermal Fatigue of Flip Chip Solder Joints
JournalAdvanced Materials Research
AuthorsLin, Yong ChengAuthor
Lu, Jing HongAuthor
Zhang, JunAuthor
Year2010 (March)Volume97
PublisherTrans Tech Publications, Ltd.
DOIdoi:10.4028/www.scientific.net/amr.97-101.3963Search in ResearchGate
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Mindat Ref. ID11624952Long-form Identifiermindat:1:5:11624952:6
GUID0
Full ReferenceLin, Yong Cheng, Lu, Jing Hong, Zhang, Jun (2010) Numerical Simulation for the Thermal Fatigue of Flip Chip Solder Joints. Advanced Materials Research, 97. 3963-3966 doi:10.4028/www.scientific.net/amr.97-101.3963
Plain TextLin, Yong Cheng, Lu, Jing Hong, Zhang, Jun (2010) Numerical Simulation for the Thermal Fatigue of Flip Chip Solder Joints. Advanced Materials Research, 97. 3963-3966 doi:10.4028/www.scientific.net/amr.97-101.3963
In(n.d.) Advanced Materials Research Vol. 97. Trans Tech Publications, Ltd.

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