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Ding, Hui, Chen, Shi Jin, Cheng, Kai (2010) Two Dimensional Vibration-Assisted Micro-Milling: Kinematics Simulation, Chip Thickness Computation and Analysis. Advanced Materials Research, 97. 2779-2784 doi:10.4028/www.scientific.net/amr.97-101.2779

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Reference TypeJournal (article/letter/editorial)
TitleTwo Dimensional Vibration-Assisted Micro-Milling: Kinematics Simulation, Chip Thickness Computation and Analysis
JournalAdvanced Materials Research
AuthorsDing, HuiAuthor
Chen, Shi JinAuthor
Cheng, KaiAuthor
Year2010 (March)Volume97
PublisherTrans Tech Publications, Ltd.
DOIdoi:10.4028/www.scientific.net/amr.97-101.2779Search in ResearchGate
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Mindat Ref. ID11624674Long-form Identifiermindat:1:5:11624674:7
GUID0
Full ReferenceDing, Hui, Chen, Shi Jin, Cheng, Kai (2010) Two Dimensional Vibration-Assisted Micro-Milling: Kinematics Simulation, Chip Thickness Computation and Analysis. Advanced Materials Research, 97. 2779-2784 doi:10.4028/www.scientific.net/amr.97-101.2779
Plain TextDing, Hui, Chen, Shi Jin, Cheng, Kai (2010) Two Dimensional Vibration-Assisted Micro-Milling: Kinematics Simulation, Chip Thickness Computation and Analysis. Advanced Materials Research, 97. 2779-2784 doi:10.4028/www.scientific.net/amr.97-101.2779
In(n.d.) Advanced Materials Research Vol. 97. Trans Tech Publications, Ltd.

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