| Reference Type | Journal (article/letter/editorial) |
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| Title | Thickness Effect on Microstructure and Residual Stress of Annealed Copper Thin Films |
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| Journal | Materials Science Forum |
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| Authors | Vayrette, Renaud | Author |
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| Rivero, Christian | Author |
| Blayac, Sylvain | Author |
| Inal, Karim | Author |
| Year | 2011 (March) | Volume | 681 |
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| Publisher | Trans Tech Publications, Ltd. |
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| DOI | doi:10.4028/www.scientific.net/msf.681.139Search in ResearchGate |
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| Generate Citation Formats |
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| Mindat Ref. ID | 9873367 | Long-form Identifier | mindat:1:5:9873367:7 |
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|
| GUID | 0 |
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| Full Reference | Vayrette, Renaud, Rivero, Christian, Blayac, Sylvain, Inal, Karim (2011) Thickness Effect on Microstructure and Residual Stress of Annealed Copper Thin Films. Materials Science Forum, 681. 139-144 doi:10.4028/www.scientific.net/msf.681.139 |
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| Plain Text | Vayrette, Renaud, Rivero, Christian, Blayac, Sylvain, Inal, Karim (2011) Thickness Effect on Microstructure and Residual Stress of Annealed Copper Thin Films. Materials Science Forum, 681. 139-144 doi:10.4028/www.scientific.net/msf.681.139 |
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| In | (2011) Materials Science Forum Vol. 681. Trans Tech Publications, Ltd. |
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