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Wang, Ren Ping, Lei, Y.P. (2011) Numerical Simulation of Temperature Field during Laser Deep Penetration Welding. Materials Science Forum, 675. 865-867 doi:10.4028/www.scientific.net/msf.675-677.865

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Reference TypeJournal (article/letter/editorial)
TitleNumerical Simulation of Temperature Field during Laser Deep Penetration Welding
JournalMaterials Science Forum
AuthorsWang, Ren PingAuthor
Lei, Y.P.Author
Year2011 (February)Volume675
PublisherTrans Tech Publications, Ltd.
DOIdoi:10.4028/www.scientific.net/msf.675-677.865Search in ResearchGate
Generate Citation Formats
Mindat Ref. ID9873108Long-form Identifiermindat:1:5:9873108:6
GUID0
Full ReferenceWang, Ren Ping, Lei, Y.P. (2011) Numerical Simulation of Temperature Field during Laser Deep Penetration Welding. Materials Science Forum, 675. 865-867 doi:10.4028/www.scientific.net/msf.675-677.865
Plain TextWang, Ren Ping, Lei, Y.P. (2011) Numerical Simulation of Temperature Field during Laser Deep Penetration Welding. Materials Science Forum, 675. 865-867 doi:10.4028/www.scientific.net/msf.675-677.865
In(2011) Materials Science Forum Vol. 675. Trans Tech Publications, Ltd.

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