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Shi, Chun Yan, Guo, Ying Kui, Zhao, Shu Jin, Song, Chun Mei (2010) Effect of Healing Temperature on Crack-Healing of Al2O3 Toughened by SiC Particles. Materials Science Forum, 650. 109-114 doi:10.4028/www.scientific.net/msf.650.109

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Reference TypeJournal (article/letter/editorial)
TitleEffect of Healing Temperature on Crack-Healing of Al2O3 Toughened by SiC Particles
JournalMaterials Science Forum
AuthorsShi, Chun YanAuthor
Guo, Ying KuiAuthor
Zhao, Shu JinAuthor
Song, Chun MeiAuthor
Year2010 (May)Volume650
PublisherTrans Tech Publications, Ltd.
DOIdoi:10.4028/www.scientific.net/msf.650.109Search in ResearchGate
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Mindat Ref. ID9870747Long-form Identifiermindat:1:5:9870747:8
GUID0
Full ReferenceShi, Chun Yan, Guo, Ying Kui, Zhao, Shu Jin, Song, Chun Mei (2010) Effect of Healing Temperature on Crack-Healing of Al2O3 Toughened by SiC Particles. Materials Science Forum, 650. 109-114 doi:10.4028/www.scientific.net/msf.650.109
Plain TextShi, Chun Yan, Guo, Ying Kui, Zhao, Shu Jin, Song, Chun Mei (2010) Effect of Healing Temperature on Crack-Healing of Al2O3 Toughened by SiC Particles. Materials Science Forum, 650. 109-114 doi:10.4028/www.scientific.net/msf.650.109
In(2010) Materials Science Forum Vol. 650. Trans Tech Publications, Ltd.

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