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Wang, Y. B., Sui, M.L. (2009) In Situ Transmission Electron Microscopy Investigation of the Deformation Behavior of Cu with Nanoscale Twins. Materials Science Forum, 633. 63-72 doi:10.4028/www.scientific.net/msf.633-634.63

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Reference TypeJournal (article/letter/editorial)
TitleIn Situ Transmission Electron Microscopy Investigation of the Deformation Behavior of Cu with Nanoscale Twins
JournalMaterials Science Forum
AuthorsWang, Y. B.Author
Sui, M.L.Author
Year2009 (November)Volume633
PublisherTrans Tech Publications, Ltd.
DOIdoi:10.4028/www.scientific.net/msf.633-634.63Search in ResearchGate
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Mindat Ref. ID9869375Long-form Identifiermindat:1:5:9869375:9
GUID0
Full ReferenceWang, Y. B., Sui, M.L. (2009) In Situ Transmission Electron Microscopy Investigation of the Deformation Behavior of Cu with Nanoscale Twins. Materials Science Forum, 633. 63-72 doi:10.4028/www.scientific.net/msf.633-634.63
Plain TextWang, Y. B., Sui, M.L. (2009) In Situ Transmission Electron Microscopy Investigation of the Deformation Behavior of Cu with Nanoscale Twins. Materials Science Forum, 633. 63-72 doi:10.4028/www.scientific.net/msf.633-634.63
In(2009) Materials Science Forum Vol. 633. Trans Tech Publications, Ltd.

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