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Ouyang, Xiao Xian, Zhao, Hai Dong, Zhang, Ke Wu, Li, Yuan Yuan (2009) Microstructure and Tensile Properties of Al-Cu-Si Alloy with Different Solidification Pressures. Materials Science Forum, 628. 593-598 doi:10.4028/www.scientific.net/msf.628-629.593

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Reference TypeJournal (article/letter/editorial)
TitleMicrostructure and Tensile Properties of Al-Cu-Si Alloy with Different Solidification Pressures
JournalMaterials Science Forum
AuthorsOuyang, Xiao XianAuthor
Zhao, Hai DongAuthor
Zhang, Ke WuAuthor
Li, Yuan YuanAuthor
Year2009 (August)Volume628
PublisherTrans Tech Publications, Ltd.
DOIdoi:10.4028/www.scientific.net/msf.628-629.593Search in ResearchGate
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Mindat Ref. ID9869178Long-form Identifiermindat:1:5:9869178:8
GUID0
Full ReferenceOuyang, Xiao Xian, Zhao, Hai Dong, Zhang, Ke Wu, Li, Yuan Yuan (2009) Microstructure and Tensile Properties of Al-Cu-Si Alloy with Different Solidification Pressures. Materials Science Forum, 628. 593-598 doi:10.4028/www.scientific.net/msf.628-629.593
Plain TextOuyang, Xiao Xian, Zhao, Hai Dong, Zhang, Ke Wu, Li, Yuan Yuan (2009) Microstructure and Tensile Properties of Al-Cu-Si Alloy with Different Solidification Pressures. Materials Science Forum, 628. 593-598 doi:10.4028/www.scientific.net/msf.628-629.593
In(2009) Materials Science Forum Vol. 628. Trans Tech Publications, Ltd.

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