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Yang, Shu Yong, Liu, Li Sheng, Zhang, Qing Jie (2005) Fracture Analysis of Functionally Graded Thermal Barrier Coating with Interface Crack by Computational Micromechanics Method. Materials Science Forum, 492. 385-390 doi:10.4028/www.scientific.net/msf.492-493.385

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Reference TypeJournal (article/letter/editorial)
TitleFracture Analysis of Functionally Graded Thermal Barrier Coating with Interface Crack by Computational Micromechanics Method
JournalMaterials Science Forum
AuthorsYang, Shu YongAuthor
Liu, Li ShengAuthor
Zhang, Qing JieAuthor
Year2005 (August)Volume492
PublisherTrans Tech Publications, Ltd.
DOIdoi:10.4028/www.scientific.net/msf.492-493.385Search in ResearchGate
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Mindat Ref. ID9858775Long-form Identifiermindat:1:5:9858775:9
GUID0
Full ReferenceYang, Shu Yong, Liu, Li Sheng, Zhang, Qing Jie (2005) Fracture Analysis of Functionally Graded Thermal Barrier Coating with Interface Crack by Computational Micromechanics Method. Materials Science Forum, 492. 385-390 doi:10.4028/www.scientific.net/msf.492-493.385
Plain TextYang, Shu Yong, Liu, Li Sheng, Zhang, Qing Jie (2005) Fracture Analysis of Functionally Graded Thermal Barrier Coating with Interface Crack by Computational Micromechanics Method. Materials Science Forum, 492. 385-390 doi:10.4028/www.scientific.net/msf.492-493.385
In(2005) Materials Science Forum Vol. 492. Trans Tech Publications, Ltd.

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Wang, Jian Ping, Yang, Shu Yong, Liu, Li Sheng (2005) Creep Response of Ceramic/Metal Functionally Graded Thermal Barrier Coating. Materials Science Forum, 492. 495-500 doi:10.4028/www.scientific.net/msf.492-493.495
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