| Reference Type | Journal (article/letter/editorial) |
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| Title | Study on the Cure Kinetics of Middle Temperature Curing 3234 Epoxy Resin System |
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| Journal | Materials Science Forum |
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| Authors | Liu, Tian Shu | Author |
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| Chen, Xiang Bao | Author |
| Zhang, Bao Yan | Author |
| Year | 2005 (January) | Volume | 475 |
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| Publisher | Trans Tech Publications, Ltd. |
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| DOI | doi:10.4028/www.scientific.net/msf.475-479.1041Search in ResearchGate |
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| Generate Citation Formats |
| Mindat Ref. ID | 9856788 | Long-form Identifier | mindat:1:5:9856788:9 |
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| GUID | 0 |
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| Full Reference | Liu, Tian Shu, Chen, Xiang Bao, Zhang, Bao Yan (2005) Study on the Cure Kinetics of Middle Temperature Curing 3234 Epoxy Resin System. Materials Science Forum, 475. 1041-1044 doi:10.4028/www.scientific.net/msf.475-479.1041 |
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| Plain Text | Liu, Tian Shu, Chen, Xiang Bao, Zhang, Bao Yan (2005) Study on the Cure Kinetics of Middle Temperature Curing 3234 Epoxy Resin System. Materials Science Forum, 475. 1041-1044 doi:10.4028/www.scientific.net/msf.475-479.1041 |
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| In | (2005) Materials Science Forum Vol. 475. Trans Tech Publications, Ltd. |
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