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Reimanis, Ivar, Chapa, J. (2003) The Strength of Functionally Graded Joints: Crack Paths and Residual Stress for Cracks Perpendicular to the Gradient. Materials Science Forum, 423. 593-598 doi:10.4028/www.scientific.net/msf.423-425.593

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Reference TypeJournal (article/letter/editorial)
TitleThe Strength of Functionally Graded Joints: Crack Paths and Residual Stress for Cracks Perpendicular to the Gradient
JournalMaterials Science Forum
AuthorsReimanis, IvarAuthor
Chapa, J.Author
Year2003 (May)Volume423
PublisherTrans Tech Publications, Ltd.
DOIdoi:10.4028/www.scientific.net/msf.423-425.593Search in ResearchGate
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Mindat Ref. ID9853397Long-form Identifiermindat:1:5:9853397:0
GUID0
Full ReferenceReimanis, Ivar, Chapa, J. (2003) The Strength of Functionally Graded Joints: Crack Paths and Residual Stress for Cracks Perpendicular to the Gradient. Materials Science Forum, 423. 593-598 doi:10.4028/www.scientific.net/msf.423-425.593
Plain TextReimanis, Ivar, Chapa, J. (2003) The Strength of Functionally Graded Joints: Crack Paths and Residual Stress for Cracks Perpendicular to the Gradient. Materials Science Forum, 423. 593-598 doi:10.4028/www.scientific.net/msf.423-425.593
In(2003) Materials Science Forum Vol. 423. Trans Tech Publications, Ltd.

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Reimanis, Ivar, Torres, R., Muratore, Ch., Moore, John J. (1999) Using Vickers Indentation to Probe Residual Stresses in Ductile/Brittle Joints with Graded Compositions. Materials Science Forum, 308. 849-854 doi:10.4028/www.scientific.net/msf.308-311.849
Zhong, Zheng, Shu, Dong Wei, Jin, B. (2003) Analysis of a Mode III Crack in a Functionally Gradient Piezoelectric Material. Materials Science Forum, 423. 623-628 doi:10.4028/www.scientific.net/msf.423-425.623
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Huang, Gan Yun, Wang, Yue Sheng (2003) Dynamic Fracture of a Functionally Graded Coating. Materials Science Forum, 423. 645-650 doi:10.4028/www.scientific.net/msf.423-425.645
 
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