| Reference Type | Journal (article/letter/editorial) |
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| Title | Design and Thermal Shock Performance of W/Cu Functionally Graded Material used as Plasma Facing Component |
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| Journal | Materials Science Forum |
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| Authors | Ling, Yun Han | Author |
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| Bai, Xin De | Author |
| Ge, Chang Chun | Author |
| Year | 2003 (May) | Volume | 423 |
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| Publisher | Trans Tech Publications, Ltd. |
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| DOI | doi:10.4028/www.scientific.net/msf.423-425.49Search in ResearchGate |
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| Generate Citation Formats |
| Mindat Ref. ID | 9853371 | Long-form Identifier | mindat:1:5:9853371:2 |
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| GUID | 0 |
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| Full Reference | Ling, Yun Han, Bai, Xin De, Ge, Chang Chun (2003) Design and Thermal Shock Performance of W/Cu Functionally Graded Material used as Plasma Facing Component. Materials Science Forum, 423. 49-54 doi:10.4028/www.scientific.net/msf.423-425.49 |
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| Plain Text | Ling, Yun Han, Bai, Xin De, Ge, Chang Chun (2003) Design and Thermal Shock Performance of W/Cu Functionally Graded Material used as Plasma Facing Component. Materials Science Forum, 423. 49-54 doi:10.4028/www.scientific.net/msf.423-425.49 |
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| In | (2003) Materials Science Forum Vol. 423. Trans Tech Publications, Ltd. |
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