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Bai, Sheng Qiang, Chen, Li Dong, Yamamura, A. (2003) Bonding of Copper to Aluminum Nitride Substrate Using Active Alloy Interlayer. Materials Science Forum, 423. 301-304 doi:10.4028/www.scientific.net/msf.423-425.301

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Reference TypeJournal (article/letter/editorial)
TitleBonding of Copper to Aluminum Nitride Substrate Using Active Alloy Interlayer
JournalMaterials Science Forum
AuthorsBai, Sheng QiangAuthor
Chen, Li DongAuthor
Yamamura, A.Author
Year2003 (May)Volume423
PublisherTrans Tech Publications, Ltd.
DOIdoi:10.4028/www.scientific.net/msf.423-425.301Search in ResearchGate
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Mindat Ref. ID9853331Long-form Identifiermindat:1:5:9853331:4
GUID0
Full ReferenceBai, Sheng Qiang, Chen, Li Dong, Yamamura, A. (2003) Bonding of Copper to Aluminum Nitride Substrate Using Active Alloy Interlayer. Materials Science Forum, 423. 301-304 doi:10.4028/www.scientific.net/msf.423-425.301
Plain TextBai, Sheng Qiang, Chen, Li Dong, Yamamura, A. (2003) Bonding of Copper to Aluminum Nitride Substrate Using Active Alloy Interlayer. Materials Science Forum, 423. 301-304 doi:10.4028/www.scientific.net/msf.423-425.301
In(2003) Materials Science Forum Vol. 423. Trans Tech Publications, Ltd.

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