| Reference Type | Journal (article/letter/editorial) |
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| Title | Microstructural Investigation of Grain Boundary Diffusion and Recrystallization in W-Cu Composites |
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| Journal | Materials Science Forum |
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| Authors | Lee, J.S. | Author |
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| Kim, T.H. | Author |
| Lee, K.H. | Author |
| Year | 1993 (January) | Volume | 126 |
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| Publisher | Trans Tech Publications, Ltd. |
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| DOI | doi:10.4028/www.scientific.net/msf.126-128.399Search in ResearchGate |
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| Generate Citation Formats |
| Mindat Ref. ID | 9841323 | Long-form Identifier | mindat:1:5:9841323:2 |
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| GUID | 0 |
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| Full Reference | Lee, J.S., Kim, T.H., Lee, K.H. (1993) Microstructural Investigation of Grain Boundary Diffusion and Recrystallization in W-Cu Composites. Materials Science Forum, 126. 399-402 doi:10.4028/www.scientific.net/msf.126-128.399 |
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| Plain Text | Lee, J.S., Kim, T.H., Lee, K.H. (1993) Microstructural Investigation of Grain Boundary Diffusion and Recrystallization in W-Cu Composites. Materials Science Forum, 126. 399-402 doi:10.4028/www.scientific.net/msf.126-128.399 |
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| In | (1993) Materials Science Forum Vol. 126. Trans Tech Publications, Ltd. |
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