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Reference Type	Journal (article/letter/editorial)
Title	Stress-Voiding and Electromigration Failures in Narrow Metal Interconnects
Journal	Materials Science Forum
Authors	Nichols, C.S.		Author
Authors	Smith, David A.		Author
Year	1993 (January)	Volume	126
Publisher	Trans Tech Publications, Ltd.
DOI	doi:10.4028/www.scientific.net/msf.126-128.351Search in ResearchGate
	Generate Citation Formats
Mindat Ref. ID	9841311	Long-form Identifier	mindat:1:5:9841311:7
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Full Reference	Nichols, C.S., Smith, David A. (1993) Stress-Voiding and Electromigration Failures in Narrow Metal Interconnects. Materials Science Forum, 126. 351-354 doi:10.4028/www.scientific.net/msf.126-128.351
Plain Text	Nichols, C.S., Smith, David A. (1993) Stress-Voiding and Electromigration Failures in Narrow Metal Interconnects. Materials Science Forum, 126. 351-354 doi:10.4028/www.scientific.net/msf.126-128.351
In	(1993) Materials Science Forum Vol. 126. Trans Tech Publications, Ltd.

	*Broniatowski, A. (1993) Metal Precipitation and the Electronic Properties of Twinned Boundaries in Silicon. Materials Science Forum, 126. 721-732 doi:10.4028/www.scientific.net/msf.126-128.721*
	*(1993) Materials Science Forum, 126. Trans Tech Publications, Ltd. doi:10.4028/www.scientific.net/msf.126-128*
	*Sotiropoulou, D., Nikolopoulos, P. (1993) Work of Adhesion in Zirconia-Liquid Metal Systems. Materials Science Forum, 126. 691-694 doi:10.4028/www.scientific.net/msf.126-128.691*
	*Birringer, Rainer (1993) Stability of Nanocrystalline Materials. Materials Science Forum, 126. 824 doi:10.4028/www.scientific.net/msf.126-128.824*
	*Thibault, J. (1993) IIB92: Concluding Remarks. Materials Science Forum, 126. 837pp. doi:10.4028/www.scientific.net/msf.126-128.837*
	*Serra, A., Bacon, David J. (1993) Computer Simulation of Twinning Dislocations in Zirconium and Other H.C.P. Metals. Materials Science Forum, 126. 69-72 doi:10.4028/www.scientific.net/msf.126-128.69*
	*Rivière, Andre, Fadel, L., Woirgard, J. (1993) High Temperature Damping in Metal Matrix Composites. Materials Science Forum, 126. 671-674 doi:10.4028/www.scientific.net/msf.126-128.671*
	*Peyrot, A., Backhaus-Ricoult, M., Hagège, S. (1993) Metal-Ceramic Interfaces in Internally Reduced Mixed Oxides. Materials Science Forum, 126. 699-702 doi:10.4028/www.scientific.net/msf.126-128.699*
	*Fortes, M.A. (1993) Triple Junctions in Crystalline Solids. Materials Science Forum, 126. 343-346 doi:10.4028/www.scientific.net/msf.126-128.343*
	*Srolovitz, David J., Wang, H.Y., Najafabadi, R. (1993) Simulating Equilibrium Grain Boundary Segregation. Materials Science Forum, 126. 23-24 doi:10.4028/www.scientific.net/msf.126-128.23*
	*Menyhard, M. (1993) Silver Grain Boundary Segregation in Copper. Materials Science Forum, 126. 205-208 doi:10.4028/www.scientific.net/msf.126-128.205*

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Nichols, C.S., Smith, David A. (1993) Stress-Voiding and Electromigration Failures in Narrow Metal Interconnects. Materials Science Forum, 126. 351-354 doi:10.4028/www.scientific.net/msf.126-128.351

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