Ballo, P., Slugeň, V. (2005) Grain boundary sliding and migration in copper: the effect of vacancies. Computational Materials Science, 33 (4). 491-498 doi:10.1016/j.commatsci.2004.09.049
| Reference Type | Journal (article/letter/editorial) | ||
|---|---|---|---|
| Title | Grain boundary sliding and migration in copper: the effect of vacancies | ||
| Journal | Computational Materials Science | ||
| Authors | Ballo, P. | Author | |
| Slugeň, V. | Author | ||
| Year | 2005 (June) | Volume | 33 |
| Issue | 4 | ||
| Publisher | Elsevier BV | ||
| DOI | doi:10.1016/j.commatsci.2004.09.049Search in ResearchGate | ||
| Generate Citation Formats | |||
| Mindat Ref. ID | 9504153 | Long-form Identifier | mindat:1:5:9504153:9 |
| GUID | 0 | ||
| Full Reference | Ballo, P., Slugeň, V. (2005) Grain boundary sliding and migration in copper: the effect of vacancies. Computational Materials Science, 33 (4). 491-498 doi:10.1016/j.commatsci.2004.09.049 | ||
| Plain Text | Ballo, P., Slugeň, V. (2005) Grain boundary sliding and migration in copper: the effect of vacancies. Computational Materials Science, 33 (4). 491-498 doi:10.1016/j.commatsci.2004.09.049 | ||
| In | (2005, June) Computational Materials Science Vol. 33 (4) Elsevier BV | ||
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