| Reference Type | Journal (article/letter/editorial) |
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| Title | Study on Curing Kinetics of Heat-resistant Flexible Polyamide Modified Epoxy Resin Adhesive |
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| Journal | Research Journal of Applied Sciences, Engineering and Technology |
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| Authors | Li, Hua | Author |
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| Wang, Hongkai | Author |
| Jiao, Xingli | Author |
| Year | 2015 (April 25) | Volume | 9 |
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| Publisher | Maxwell Scientific Publication Corp. |
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| DOI | doi:10.19026/rjaset.9.2609Search in ResearchGate |
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| Generate Citation Formats |
| Mindat Ref. ID | 9244252 | Long-form Identifier | mindat:1:5:9244252:4 |
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|
| GUID | 0 |
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| Full Reference | Li, Hua, Wang, Hongkai, Jiao, Xingli (2015) Study on Curing Kinetics of Heat-resistant Flexible Polyamide Modified Epoxy Resin Adhesive. Research Journal of Applied Sciences, Engineering and Technology, 9. 1143-1147 doi:10.19026/rjaset.9.2609 |
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| Plain Text | Li, Hua, Wang, Hongkai, Jiao, Xingli (2015) Study on Curing Kinetics of Heat-resistant Flexible Polyamide Modified Epoxy Resin Adhesive. Research Journal of Applied Sciences, Engineering and Technology, 9. 1143-1147 doi:10.19026/rjaset.9.2609 |
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| In | (n.d.) Research Journal of Applied Sciences, Engineering and Technology Vol. 9. Maxwell Scientific Publication Corp. |
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