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HA, SANG-SU, HA, SANG-OK, JANG, JIN-KYU, KIM, JONG-WOONG, LEE, JONG-BUM, JUNG, SEUNG-BOO (2009) FAILURE BEHAVIORS OF FLIP CHIP SOLDER JOINTS UNDER VARIOUS LOADING CONDITIONS OF HIGH-SPEED SHEAR TEST. International Journal of Modern Physics B, 23 (6). 1809-1815 doi:10.1142/s0217979209061664

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Reference TypeJournal (article/letter/editorial)
TitleFAILURE BEHAVIORS OF FLIP CHIP SOLDER JOINTS UNDER VARIOUS LOADING CONDITIONS OF HIGH-SPEED SHEAR TEST
JournalInternational Journal of Modern Physics B
AuthorsHA, SANG-SUAuthor
HA, SANG-OKAuthor
JANG, JIN-KYUAuthor
KIM, JONG-WOONGAuthor
LEE, JONG-BUMAuthor
JUNG, SEUNG-BOOAuthor
Year2009 (March 20)Volume23
Issue6
PublisherWorld Scientific Pub Co Pte Lt
DOIdoi:10.1142/s0217979209061664Search in ResearchGate
Generate Citation Formats
Mindat Ref. ID8908968Long-form Identifiermindat:1:5:8908968:0
GUID0
Full ReferenceHA, SANG-SU, HA, SANG-OK, JANG, JIN-KYU, KIM, JONG-WOONG, LEE, JONG-BUM, JUNG, SEUNG-BOO (2009) FAILURE BEHAVIORS OF FLIP CHIP SOLDER JOINTS UNDER VARIOUS LOADING CONDITIONS OF HIGH-SPEED SHEAR TEST. International Journal of Modern Physics B, 23 (6). 1809-1815 doi:10.1142/s0217979209061664
Plain TextHA, SANG-SU, HA, SANG-OK, JANG, JIN-KYU, KIM, JONG-WOONG, LEE, JONG-BUM, JUNG, SEUNG-BOO (2009) FAILURE BEHAVIORS OF FLIP CHIP SOLDER JOINTS UNDER VARIOUS LOADING CONDITIONS OF HIGH-SPEED SHEAR TEST. International Journal of Modern Physics B, 23 (6). 1809-1815 doi:10.1142/s0217979209061664
In(2009, March) International Journal of Modern Physics B Vol. 23 (6) World Scientific Pub Co Pte Lt

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Kim, Jong-Woong, Jung, Seung-Boo (2010) Failure mechanism of Pb-bearing and Pb-free solder joints under high-speed shear loading. Metals and Materials International, 16. 7-12 doi:10.1007/s12540-010-0007-x
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