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YAN, YIWU, GENG, LIN, LIU, DAYONG (2009) INFLUENCE OF REINFORCEMENT SIZE ON MICROPLASTIC DEFORMATION BEHAVIOR OF SiCP/Al COMPOSITES. International Journal of Modern Physics B, 23 (6). 1455-1460 doi:10.1142/s0217979209061093

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Reference TypeJournal (article/letter/editorial)
TitleINFLUENCE OF REINFORCEMENT SIZE ON MICROPLASTIC DEFORMATION BEHAVIOR OF SiCP/Al COMPOSITES
JournalInternational Journal of Modern Physics B
AuthorsYAN, YIWUAuthor
GENG, LINAuthor
LIU, DAYONGAuthor
Year2009 (March 20)Volume23
Issue6
PublisherWorld Scientific Pub Co Pte Lt
DOIdoi:10.1142/s0217979209061093Search in ResearchGate
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Mindat Ref. ID8908911Long-form Identifiermindat:1:5:8908911:2
GUID0
Full ReferenceYAN, YIWU, GENG, LIN, LIU, DAYONG (2009) INFLUENCE OF REINFORCEMENT SIZE ON MICROPLASTIC DEFORMATION BEHAVIOR OF SiCP/Al COMPOSITES. International Journal of Modern Physics B, 23 (6). 1455-1460 doi:10.1142/s0217979209061093
Plain TextYAN, YIWU, GENG, LIN, LIU, DAYONG (2009) INFLUENCE OF REINFORCEMENT SIZE ON MICROPLASTIC DEFORMATION BEHAVIOR OF SiCP/Al COMPOSITES. International Journal of Modern Physics B, 23 (6). 1455-1460 doi:10.1142/s0217979209061093
In(2009, March) International Journal of Modern Physics B Vol. 23 (6) World Scientific Pub Co Pte Lt

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Yan, YiWu, Geng, Lin (2007) Effects of particle size on the thermal expansion behavior of SiCp/Al composites. Journal of Materials Science, 42. 6433-6438 doi:10.1007/s10853-006-1200-7
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Geng, Lin, Yan, Yi Wu (2007) Effects of Particle Size on the Thermal Physical Properties of SiCp/Al Composites. Key Engineering Materials, 351. 131-134 doi:10.4028/www.scientific.net/kem.351.131
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