Tessier, G., Bardoux, M., Boué, C., Filloy, C., Fournier, D. (2007) Back side thermal imaging of integrated circuits at high spatial resolution. Applied Physics Letters, 90 (17). 171112pp. doi:10.1063/1.2732179
| Reference Type | Journal (article/letter/editorial) | ||
|---|---|---|---|
| Title | Back side thermal imaging of integrated circuits at high spatial resolution | ||
| Journal | Applied Physics Letters | ||
| Authors | Tessier, G. | Author | |
| Bardoux, M. | Author | ||
| Boué, C. | Author | ||
| Filloy, C. | Author | ||
| Fournier, D. | Author | ||
| Year | 2007 (April 23) | Volume | 90 |
| Issue | 17 | ||
| Publisher | AIP Publishing | ||
| DOI | doi:10.1063/1.2732179Search in ResearchGate | ||
| Generate Citation Formats | |||
| Mindat Ref. ID | 8553675 | Long-form Identifier | mindat:1:5:8553675:5 |
| GUID | 0 | ||
| Full Reference | Tessier, G., Bardoux, M., Boué, C., Filloy, C., Fournier, D. (2007) Back side thermal imaging of integrated circuits at high spatial resolution. Applied Physics Letters, 90 (17). 171112pp. doi:10.1063/1.2732179 | ||
| Plain Text | Tessier, G., Bardoux, M., Boué, C., Filloy, C., Fournier, D. (2007) Back side thermal imaging of integrated circuits at high spatial resolution. Applied Physics Letters, 90 (17). 171112pp. doi:10.1063/1.2732179 | ||
| In | (2007, April) Applied Physics Letters Vol. 90 (17) AIP Publishing | ||
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