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Zhang, X., Anderoglu, O., Misra, A., Wang, H. (2007) Influence of deposition rate on the formation of growth twins in sputter-deposited 330 austenitic stainless steel films. Applied Physics Letters, 90 (15). 153101pp. doi:10.1063/1.2720708

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Reference TypeJournal (article/letter/editorial)
TitleInfluence of deposition rate on the formation of growth twins in sputter-deposited 330 austenitic stainless steel films
JournalApplied Physics Letters
AuthorsZhang, X.Author
Anderoglu, O.Author
Misra, A.Author
Wang, H.Author
Year2007 (April 9)Volume90
Issue15
PublisherAIP Publishing
DOIdoi:10.1063/1.2720708Search in ResearchGate
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Mindat Ref. ID8553327Long-form Identifiermindat:1:5:8553327:1
GUID0
Full ReferenceZhang, X., Anderoglu, O., Misra, A., Wang, H. (2007) Influence of deposition rate on the formation of growth twins in sputter-deposited 330 austenitic stainless steel films. Applied Physics Letters, 90 (15). 153101pp. doi:10.1063/1.2720708
Plain TextZhang, X., Anderoglu, O., Misra, A., Wang, H. (2007) Influence of deposition rate on the formation of growth twins in sputter-deposited 330 austenitic stainless steel films. Applied Physics Letters, 90 (15). 153101pp. doi:10.1063/1.2720708
In(2007, April) Applied Physics Letters Vol. 90 (15) AIP Publishing

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Zhang, X., Misra, A., Wang, H., Swadener, J. G., Lima, A. L., Hundley, M. F., Hoagland, R. G. (2005) Thermal stability of sputter-deposited 330 austenitic stainless-steel thin films with nanoscale growth twins. Applied Physics Letters, 87 (23). 233116pp. doi:10.1063/1.2135871
Anderoglu, O., Misra, A., Wang, H., Zhang, X. (2008) Thermal stability of sputtered Cu films with nanoscale growth twins. Journal of Applied Physics, 103 (9). 94322pp. doi:10.1063/1.2913322
Zhang, X., Misra, A. (2004) Residual stresses in sputter-deposited copper/330 stainless steel multilayers. Journal of Applied Physics, 96 (12). 7173-7178 doi:10.1063/1.1813617
Zhang, X., Wang, H., Chen, X. H., Lu, L., Lu, K., Hoagland, R. G., Misra, A. (2006) High-strength sputter-deposited Cu foils with preferred orientation of nanoscale growth twins. Applied Physics Letters, 88 (17). 173116pp. doi:10.1063/1.2198482
Zhang, X., Misra, A., Schulze, R.K., Wetteland, C.J., Wang, H., Nastasi, M. (2004) Critical factors that determine face-centered cubic to body-centered cubic phase transformation in sputter-deposited austenitic stainless steel films. Journal of Materials Research, 19 (6) 1696-1702 doi:10.1557/jmr.2004.0215
Zhang, X., Misra, A., Wang, H., Lima, A. L., Hundley, M. F., Hoagland, R. G. (2005) Effects of deposition parameters on residual stresses, hardness and electrical resistivity of nanoscale twinned 330 stainless steel thin films. Journal of Applied Physics, 97 (9). 94302pp. doi:10.1063/1.1883724
Anderoglu, O., Misra, A., Wang, H., Ronning, F., Hundley, M. F., Zhang, X. (2008) Epitaxial nanotwinned Cu films with high strength and high conductivity. Applied Physics Letters, 93 (8). 83108pp. doi:10.1063/1.2969409
Zhang, X., Misra, A., Wang, H., Nastasi, M., Embury, J. D., Mitchell, T. E., Hoagland, R. G., Hirth, J. P. (2004) Nanoscale-twinning-induced strengthening in austenitic stainless steel thin films. Applied Physics Letters, 84 (7). 1096-1098 doi:10.1063/1.1647690
Zhang, X., Schulze, R. K., Wang, H., Misra, A. (2007) Thermal stability of sputtered Cu∕304 stainless steel multilayer films. Journal of Applied Physics, 101 (12). 124311pp. doi:10.1063/1.2748628
Anderoglu, O., Misra, A., Ronning, F., Wang, H., Zhang, X. (2009) Significant enhancement of the strength-to-resistivity ratio by nanotwins in epitaxial Cu films. Journal of Applied Physics, 106 (2). 24313pp. doi:10.1063/1.3176483
Wang, J., Anderoglu, O., Hirth, J. P., Misra, A., Zhang, X. (2009) Dislocation structures of Σ3 {112} twin boundaries in face centered cubic metals. Applied Physics Letters, 95 (2). 21908pp. doi:10.1063/1.3176979
 
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