LUO, Cheng, XIONG, Xiang, DONG, Shi-jie (2011) TiB2/Ni coatings on surface of copper alloy electrode prepared by electrospark deposition. Transactions of Nonferrous Metals Society of China, 21 (2). 317-321 doi:10.1016/s1003-6326(11)60715-2
| Reference Type | Journal (article/letter/editorial) | ||
|---|---|---|---|
| Title | TiB2/Ni coatings on surface of copper alloy electrode prepared by electrospark deposition | ||
| Journal | Transactions of Nonferrous Metals Society of China | ||
| Authors | LUO, Cheng | Author | |
| XIONG, Xiang | Author | ||
| DONG, Shi-jie | Author | ||
| Year | 2011 (February) | Volume | 21 |
| Issue | 2 | ||
| Publisher | Elsevier BV | ||
| DOI | doi:10.1016/s1003-6326(11)60715-2Search in ResearchGate | ||
| Generate Citation Formats | |||
| Mindat Ref. ID | 7848754 | Long-form Identifier | mindat:1:5:7848754:9 |
| GUID | 0 | ||
| Full Reference | LUO, Cheng, XIONG, Xiang, DONG, Shi-jie (2011) TiB2/Ni coatings on surface of copper alloy electrode prepared by electrospark deposition. Transactions of Nonferrous Metals Society of China, 21 (2). 317-321 doi:10.1016/s1003-6326(11)60715-2 | ||
| Plain Text | LUO, Cheng, XIONG, Xiang, DONG, Shi-jie (2011) TiB2/Ni coatings on surface of copper alloy electrode prepared by electrospark deposition. Transactions of Nonferrous Metals Society of China, 21 (2). 317-321 doi:10.1016/s1003-6326(11)60715-2 | ||
| In | (2011, February) Transactions of Nonferrous Metals Society of China Vol. 21 (2) Elsevier BV | ||
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