Wang, Hong-yu, Tian, Jian (2014) Thermal conductivity enhancement in Cu/diamond composites with surface-roughened diamonds. Applied Physics A, 116. 265-271 doi:10.1007/s00339-013-8117-1
| Reference Type | Journal (article/letter/editorial) | ||
|---|---|---|---|
| Title | Thermal conductivity enhancement in Cu/diamond composites with surface-roughened diamonds | ||
| Journal | Applied Physics A | ||
| Authors | Wang, Hong-yu | Author | |
| Tian, Jian | Author | ||
| Year | 2014 (July) | Volume | 116 |
| Publisher | Springer Science and Business Media LLC | ||
| DOI | doi:10.1007/s00339-013-8117-1Search in ResearchGate | ||
| Generate Citation Formats | |||
| Mindat Ref. ID | 6017045 | Long-form Identifier | mindat:1:5:6017045:9 |
| GUID | 0 | ||
| Full Reference | Wang, Hong-yu, Tian, Jian (2014) Thermal conductivity enhancement in Cu/diamond composites with surface-roughened diamonds. Applied Physics A, 116. 265-271 doi:10.1007/s00339-013-8117-1 | ||
| Plain Text | Wang, Hong-yu, Tian, Jian (2014) Thermal conductivity enhancement in Cu/diamond composites with surface-roughened diamonds. Applied Physics A, 116. 265-271 doi:10.1007/s00339-013-8117-1 | ||
| In | (2014) Applied Physics A Vol. 116. Springer Science and Business Media LLC | ||
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