HSUEH, C. H., EVANS, A. G. (1985) Residual Stresses and Cracking in Metal/Ceramic Systems for Microelectronics Packaging. Journal of the American Ceramic Society, 68 (3). 120-127 doi:10.1111/j.1151-2916.1985.tb09648.x
| Reference Type | Journal (article/letter/editorial) | ||
|---|---|---|---|
| Title | Residual Stresses and Cracking in Metal/Ceramic Systems for Microelectronics Packaging | ||
| Journal | Journal of the American Ceramic Society | ||
| Authors | HSUEH, C. H. | Author | |
| EVANS, A. G. | Author | ||
| Year | 1985 (March) | Volume | 68 |
| Issue | 3 | ||
| Publisher | Wiley | ||
| DOI | doi:10.1111/j.1151-2916.1985.tb09648.xSearch in ResearchGate | ||
| Generate Citation Formats | |||
| Mindat Ref. ID | 4087409 | Long-form Identifier | mindat:1:5:4087409:8 |
| GUID | 0 | ||
| Full Reference | HSUEH, C. H., EVANS, A. G. (1985) Residual Stresses and Cracking in Metal/Ceramic Systems for Microelectronics Packaging. Journal of the American Ceramic Society, 68 (3). 120-127 doi:10.1111/j.1151-2916.1985.tb09648.x | ||
| Plain Text | HSUEH, C. H., EVANS, A. G. (1985) Residual Stresses and Cracking in Metal/Ceramic Systems for Microelectronics Packaging. Journal of the American Ceramic Society, 68 (3). 120-127 doi:10.1111/j.1151-2916.1985.tb09648.x | ||
| In | (1985, March) Journal of the American Ceramic Society Vol. 68 (3) Wiley | ||
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