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Chang, Chun, Lu, Xubin, Lei, Zhanwu, Wang, Zenglin, Zhao, Chuan (2016) 2-Mercaptopyridine as a new leveler for bottom-up filling of micro-vias in copper electroplating. Electrochimica Acta, 208. 33-38 doi:10.1016/j.electacta.2016.04.177

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Reference TypeJournal (article/letter/editorial)
Title2-Mercaptopyridine as a new leveler for bottom-up filling of micro-vias in copper electroplating
JournalElectrochimica Acta
AuthorsChang, ChunAuthor
Lu, XubinAuthor
Lei, ZhanwuAuthor
Wang, ZenglinAuthor
Zhao, ChuanAuthor
Year2016 (August)Volume208
PublisherElsevier BV
DOIdoi:10.1016/j.electacta.2016.04.177Search in ResearchGate
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Mindat Ref. ID3208466Long-form Identifiermindat:1:5:3208466:3
GUID0
Full ReferenceChang, Chun, Lu, Xubin, Lei, Zhanwu, Wang, Zenglin, Zhao, Chuan (2016) 2-Mercaptopyridine as a new leveler for bottom-up filling of micro-vias in copper electroplating. Electrochimica Acta, 208. 33-38 doi:10.1016/j.electacta.2016.04.177
Plain TextChang, Chun, Lu, Xubin, Lei, Zhanwu, Wang, Zenglin, Zhao, Chuan (2016) 2-Mercaptopyridine as a new leveler for bottom-up filling of micro-vias in copper electroplating. Electrochimica Acta, 208. 33-38 doi:10.1016/j.electacta.2016.04.177
In(2016) Electrochimica Acta Vol. 208. Elsevier BV

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