Kim, Kwang Hwan, Lim, Taeho, Park, Kyung Ju, Koo, Hyo-Chol, Kim, Myung Jun, Kim, Jae Jeong (2015) Investigation of Cu growth phenomena on Ru substrate during electroless deposition using hydrazine as a reducing agent. Electrochimica Acta, 151. 249-255 doi:10.1016/j.electacta.2014.11.036
| Reference Type | Journal (article/letter/editorial) | ||
|---|---|---|---|
| Title | Investigation of Cu growth phenomena on Ru substrate during electroless deposition using hydrazine as a reducing agent | ||
| Journal | Electrochimica Acta | ||
| Authors | Kim, Kwang Hwan | Author | |
| Lim, Taeho | Author | ||
| Park, Kyung Ju | Author | ||
| Koo, Hyo-Chol | Author | ||
| Kim, Myung Jun | Author | ||
| Kim, Jae Jeong | Author | ||
| Year | 2015 (January) | Volume | 151 |
| Publisher | Elsevier BV | ||
| DOI | doi:10.1016/j.electacta.2014.11.036Search in ResearchGate | ||
| Generate Citation Formats | |||
| Mindat Ref. ID | 3204657 | Long-form Identifier | mindat:1:5:3204657:5 |
| GUID | 0 | ||
| Full Reference | Kim, Kwang Hwan, Lim, Taeho, Park, Kyung Ju, Koo, Hyo-Chol, Kim, Myung Jun, Kim, Jae Jeong (2015) Investigation of Cu growth phenomena on Ru substrate during electroless deposition using hydrazine as a reducing agent. Electrochimica Acta, 151. 249-255 doi:10.1016/j.electacta.2014.11.036 | ||
| Plain Text | Kim, Kwang Hwan, Lim, Taeho, Park, Kyung Ju, Koo, Hyo-Chol, Kim, Myung Jun, Kim, Jae Jeong (2015) Investigation of Cu growth phenomena on Ru substrate during electroless deposition using hydrazine as a reducing agent. Electrochimica Acta, 151. 249-255 doi:10.1016/j.electacta.2014.11.036 | ||
| In | (2015) Electrochimica Acta Vol. 151. Elsevier BV | ||
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