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Qiao, Feng, West, Alan C. (2014) The impact of cations on nucleus density during copper electrodeposition. Electrochimica Acta, 150. 8-14 doi:10.1016/j.electacta.2014.10.135

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Reference TypeJournal (article/letter/editorial)
TitleThe impact of cations on nucleus density during copper electrodeposition
JournalElectrochimica Acta
AuthorsQiao, FengAuthor
West, Alan C.Author
Year2014 (December)Volume150
PublisherElsevier BV
DOIdoi:10.1016/j.electacta.2014.10.135Search in ResearchGate
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Mindat Ref. ID3204599Long-form Identifiermindat:1:5:3204599:2
GUID0
Full ReferenceQiao, Feng, West, Alan C. (2014) The impact of cations on nucleus density during copper electrodeposition. Electrochimica Acta, 150. 8-14 doi:10.1016/j.electacta.2014.10.135
Plain TextQiao, Feng, West, Alan C. (2014) The impact of cations on nucleus density during copper electrodeposition. Electrochimica Acta, 150. 8-14 doi:10.1016/j.electacta.2014.10.135
In(2014) Electrochimica Acta Vol. 150. Elsevier BV

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Qiao, Feng, O'Brien, Brendan B., Dunn, Kathleen A., West, Alan C. (2013) The Effect of Fe(III)/Fe(II) Redox Couple on Nucleus Density during Cu Electrodeposition Process. Journal of the Electrochemical Society, 160. doi:10.1149/2.142306jes
Volov, Igor, Sun, Xiaoxuan, Gadikota, Greeshma, Shi, Ping, West, Alan C. (2013) Electrodeposition of copper–tin film alloys for interconnect applications. Electrochimica Acta, 89. 792-797 doi:10.1016/j.electacta.2012.11.102
Emekli, Ugur, West, Alan C. (2009) Effect of additives and pulse plating on copper nucleation onto Ru. Electrochimica Acta, 54 (4). 1177-1183 doi:10.1016/j.electacta.2008.08.065
Willey, Mark J., West, Alan C. (2007) SPS Adsorption and Desorption during Copper Electrodeposition and Its Impact on PEG Adsorption. Journal of the Electrochemical Society, 154. doi:10.1149/1.2431320
Bjelkevig, Cameron, Kelber, Jeff (2009) Stability of iodine on ruthenium during copper electrodeposition and its effects on the nucleation behavior of electrodeposited copper. Electrochimica Acta, 54 (15). 3892-3898 doi:10.1016/j.electacta.2009.02.008
Xiao, Ning, Li, Deyu, Cui, Guofeng, Li, Ning, Li, Qing, Wu, Gang (2014) Adsorption behavior of triblock copolymer suppressors during the copper electrodeposition. Electrochimica Acta, 116. 284-291 doi:10.1016/j.electacta.2013.11.056
Ghodbane, Ouassim, Roué, Lionel, Bélanger, Daniel (2007) Copper electrodeposition on pyrolytic graphite electrodes: Effect of the copper salt on the electrodeposition process. Electrochimica Acta, 52 (19). 5843-5855 doi:10.1016/j.electacta.2007.03.009
BuAli, Q., Johns, L.E., Narayanan, R. (2006) The growth of roughness during electrodeposition. Electrochimica Acta, 51 (14). 2881-2889 doi:10.1016/j.electacta.2005.08.020
Yang, Liu, Radisic, Aleksandar, Nagar, Magi, Deconinck, Johan, Vereecken, Philippe M., West, Alan C. (2012) Multi-scale modeling of direct copper plating on resistive non-copper substrates. Electrochimica Acta, 78. 524-531 doi:10.1016/j.electacta.2012.06.076
Radisic, Aleksandar, Cao, Yang, Taephaisitphongse, Premratn, West, Alan C., Searson, Peter C. (2003) Direct Copper Electrodeposition on TaN Barrier Layers. Journal of the Electrochemical Society, 150. doi:10.1149/1.1565137
Knehr, K.W., Eng, Christopher, Wang, Jun, West, Alan C. (2015) Transmission X-Ray Microscopy of the Galvanostatic Growth of Lead Sulfate on Lead: Impact of Lignosulfonate. Electrochimica Acta, 168. 346-355 doi:10.1016/j.electacta.2015.04.022
 
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