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Im, Byoungyong, Kim, Sunjung (2014) Nucleation and Growth of Cu Electrodeposited Directly on W Diffusion Barrier in Neutral Electrolyte. Electrochimica Acta, 130. 52-59 doi:10.1016/j.electacta.2014.02.154

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Reference TypeJournal (article/letter/editorial)
TitleNucleation and Growth of Cu Electrodeposited Directly on W Diffusion Barrier in Neutral Electrolyte
JournalElectrochimica Acta
AuthorsIm, ByoungyongAuthor
Kim, SunjungAuthor
Year2014 (June)Volume130
PublisherElsevier BV
DOIdoi:10.1016/j.electacta.2014.02.154Search in ResearchGate
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Mindat Ref. ID3203152Long-form Identifiermindat:1:5:3203152:8
GUID0
Full ReferenceIm, Byoungyong, Kim, Sunjung (2014) Nucleation and Growth of Cu Electrodeposited Directly on W Diffusion Barrier in Neutral Electrolyte. Electrochimica Acta, 130. 52-59 doi:10.1016/j.electacta.2014.02.154
Plain TextIm, Byoungyong, Kim, Sunjung (2014) Nucleation and Growth of Cu Electrodeposited Directly on W Diffusion Barrier in Neutral Electrolyte. Electrochimica Acta, 130. 52-59 doi:10.1016/j.electacta.2014.02.154
In(2014) Electrochimica Acta Vol. 130. Elsevier BV

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Im, Byoungyong; Kim, Sunjung; Kim, Soo-Hyun; Park, Kwangsuk (2026) Potentiostatic electrodeposition of Cu thin films directly on ALD Ru diffusion barrier and trench-filling for Cu interconnect. Electrochimica Acta, 551. doi:10.1016/j.electacta.2026.148175
Im, Byoungyong, Kim, Sunjung (2015) Surface Morphology Evolution of Cu Thin Films Electrodeposited Directly on Ti Diffusion Barrier in Citric Acid. Journal of the Electrochemical Society, 162. doi:10.1149/2.0091510jes
Im, Byoungyong, Mun, Kiyeung, Kim, Sunjung, Kim, Soo-Hyun (2023) Seedless electrodeposition of Cu thin films on ALD Ru diffusion barriers with different electrical properties. Electrochimica Acta, 443. 141971 doi:10.1016/j.electacta.2023.141971
Kim, Sunjung, Duquette, David J. (2006) Nucleation Characteristics of Directly Electrodeposited Copper on TiN. Journal of the Electrochemical Society, 153. doi:10.1149/1.2219712
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Kim, Sunjung, Jang, Jun-Ho, Lee, Jeong-Soo, Duquette, David J. (2007) Stress behavior of electrodeposited copper films as mechanical supporters for light emitting diodes. Electrochimica Acta, 52 (16). 5258-5265 doi:10.1016/j.electacta.2007.02.040
Tran, C.C.H., Santos-Peña, J., Damas, C. (2020) Electrodeposited manganese oxide supercapacitor microelectrodes with enhanced performance in neutral aqueous electrolyte. Electrochimica Acta, 335. 135564pp. doi:10.1016/j.electacta.2019.135564
Kim, Sunjung, Duquette, David J. (2006) Effect of Chemical Composition on Adhesion of Directly Electrodeposited Copper Film on TiN. Journal of the Electrochemical Society, 153. doi:10.1149/1.2189971
Lafouresse, M.C., Heard, P.J., Schwarzacher, W. (2007) Surface roughness analysis of electrodeposited Cu. Electrochimica Acta, 53 (1). 229-232 doi:10.1016/j.electacta.2007.05.068
Gotti, Guillaume, Fajerwerg, Katia, Evrard, David, Gros, Pierre (2014) Electrodeposited gold nanoparticles on glassy carbon: Correlation between nanoparticles characteristics and oxygen reduction kinetics in neutral media. Electrochimica Acta, 128. 412-419 doi:10.1016/j.electacta.2013.10.172
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