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Son, Junhyuk, Yu, Dong-Yurl, Kim, Min-Su, Ko, Yong-Ho, Byun, Dong-Jin, Bang, Junghwan (2021) Nucleation and Morphology of Cu6Sn5 Intermetallic at the Interface between Molten Sn-0.7Cu-0.2Cr Solder and Cu Substrate. Metals, 11 (2) 210pp. doi:10.3390/met11020210

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Reference TypeJournal (article/letter/editorial)
TitleNucleation and Morphology of Cu6Sn5 Intermetallic at the Interface between Molten Sn-0.7Cu-0.2Cr Solder and Cu Substrate
JournalMetals
AuthorsSon, JunhyukAuthor
Yu, Dong-YurlAuthor
Kim, Min-SuAuthor
Ko, Yong-HoAuthor
Byun, Dong-JinAuthor
Bang, JunghwanAuthor
Year2021 (January 25)Volume11
Issue2
PublisherMDPI AG
DOIdoi:10.3390/met11020210Search in ResearchGate
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Mindat Ref. ID13628172Long-form Identifiermindat:1:5:13628172:8
GUID0
Full ReferenceSon, Junhyuk, Yu, Dong-Yurl, Kim, Min-Su, Ko, Yong-Ho, Byun, Dong-Jin, Bang, Junghwan (2021) Nucleation and Morphology of Cu6Sn5 Intermetallic at the Interface between Molten Sn-0.7Cu-0.2Cr Solder and Cu Substrate. Metals, 11 (2) 210pp. doi:10.3390/met11020210
Plain TextSon, Junhyuk, Yu, Dong-Yurl, Kim, Min-Su, Ko, Yong-Ho, Byun, Dong-Jin, Bang, Junghwan (2021) Nucleation and Morphology of Cu6Sn5 Intermetallic at the Interface between Molten Sn-0.7Cu-0.2Cr Solder and Cu Substrate. Metals, 11 (2) 210pp. doi:10.3390/met11020210
In(2021, February) Metals Vol. 11 (2) MDPI AG

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Bang, Junghwan, Yu, Dong-Yurl, Ko, Yong-Ho, Kim, Min-Su, Nishikawa, Hiroshi, Lee, Chang-Woo (2017) Intermetallic compound formation and mechanical property of Sn-Cu-xCr/Cu lead-free solder joint. Journal of Alloys and Compounds, 728. 992-1001 doi:10.1016/j.jallcom.2017.09.011
Bang, Junghwan, Yu, Dong-Yurl, Yang, Ming, Ko, Yong-Ho, Yoon, Jeong-Won, Nishikawa, Hiroshi, Lee, Chang-Woo (2018) Improvement in Thermomechanical Reliability of Low Cost Sn-Based BGA Interconnects by Cr Addition. Metals, 8 (8). 586pp. doi:10.3390/met8080586
Yang, Ming, Ko, Yong-Ho, Bang, Junghwan, Kim, Taek-Soo, Lee, Chang-Woo, Zhang, Shuye, Li, Mingyu (2017) Growth inhibition of interfacial intermetallic compounds by pre-coating oriented Cu6Sn5 grains on Cu substrates. Journal of Alloys and Compounds, 701. 533-541 doi:10.1016/j.jallcom.2017.01.109
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Wang, Yao Li, Zhang, Ke Ke, Li, Chen Yang, Han, Li Juan (2011) The Morphology and Evolution of Cu6Sn5 at the Interface of Sn-2.5Ag-0.7Cu-0.1RE/Cu Solder Joint during the Isothermal Aging. Materials Science Forum, 704. 685-689 doi:10.4028/www.scientific.net/msf.704-705.685
(2003) Intermetallic compounds formed at the interface between Cu substrate and an Sn–9Zn–0.5Ag lead-free solder. Materials Research Bulletin, 38 (5) 909-916 doi:10.1016/s0025-5408(03)00024-2
Wang, Yuan, Zhao, Xiu-Chen, Liu, Ying, Wang, Yong, Li, Dong-Mei (2021) Microstructure, wetting property of Sn–Ag–Cu–Bi–xCe solder and IMC growth at solder/Cu interface during thermal cycling. Rare Metals, 40 (3) 714-719 doi:10.1007/s12598-015-0526-1
Suh, Min-Suk, Park, Chan-Jin, Kwon, Hyuk-Sang (2008) Growth kinetics of Cu–Sn intermetallic compounds at the interface of a Cu substrate and 42Sn–58Bi electrodeposits, and the influence of the intermetallic compounds on the shear resistance of solder joints. Materials Chemistry and Physics, 110. 95-99 doi:10.1016/j.matchemphys.2008.01.021
Somidin, Flora, Mohd Salleh, Mohd Arif Anuar, Khairel, Rafezi Ahmad (2012) Intermetallic Compound Formation on Solder Alloy/Cu-Substrate Interface Using Lead-Free Sn-0.7Cu/Recycled-Aluminum Composite Solder. Advanced Materials Research, 620. 105-111 doi:10.4028/www.scientific.net/amr.620.105
 
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