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Guan, Chang Feng, Peng, Wei, Qin, Liu, Zhang, You Chen, Yang, Wei Min (2013) A Numerical Investigation on Temperature Field in the Oven of a Rotational Molding Machine. Key Engineering Materials, 561. 336-340 doi:10.4028/www.scientific.net/kem.561.336

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Reference TypeJournal (article/letter/editorial)
TitleA Numerical Investigation on Temperature Field in the Oven of a Rotational Molding Machine
JournalKey Engineering Materials
AuthorsGuan, Chang FengAuthor
Peng, WeiAuthor
Qin, LiuAuthor
Zhang, You ChenAuthor
Yang, Wei MinAuthor
Year2013 (July)Volume561
PublisherTrans Tech Publications, Ltd.
DOIdoi:10.4028/www.scientific.net/kem.561.336Search in ResearchGate
Generate Citation Formats
Mindat Ref. ID12016282Long-form Identifiermindat:1:5:12016282:8
GUID0
Full ReferenceGuan, Chang Feng, Peng, Wei, Qin, Liu, Zhang, You Chen, Yang, Wei Min (2013) A Numerical Investigation on Temperature Field in the Oven of a Rotational Molding Machine. Key Engineering Materials, 561. 336-340 doi:10.4028/www.scientific.net/kem.561.336
Plain TextGuan, Chang Feng, Peng, Wei, Qin, Liu, Zhang, You Chen, Yang, Wei Min (2013) A Numerical Investigation on Temperature Field in the Oven of a Rotational Molding Machine. Key Engineering Materials, 561. 336-340 doi:10.4028/www.scientific.net/kem.561.336
In(n.d.) Key Engineering Materials Vol. 561. Trans Tech Publications, Ltd.

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