登录注册
Quick Links : Mindat手册The Rock H. Currier Digital LibraryMindat Newsletter [Free Download]
主页关于 MindatMindat手册Mindat的历史版权Who We Are联系我们于 Mindat.org刊登广告
捐赠给 MindatCorporate Sponsorship赞助板页已赞助的板页在 Mindat刊登 广告的广告商于 Mindat.org刊登广告
Learning CenterWhat is a mineral?The most common minerals on earthInformation for EducatorsMindat ArticlesThe ElementsThe Rock H. Currier Digital LibraryGeologic Time
搜索矿物的性质搜索矿物的化学Mineral Visual ExplorerAdvanced Locality Search随意显示任何一 种矿物Random Locality使用minID搜索邻近产地Search Articles搜索词汇表更多搜索选项
搜索:
矿物名称:
地区产地名称:
关键字:
 
Mindat手册添加新照片Rate Photos产区编辑报告Coordinate Completion Report添加词汇表项目
Mining Companies统计会员列表Mineral MuseumsClubs & Organizations矿物展及活动The Mindat目录表设备设置The Mineral QuizTime Machine
照片搜索Photo GalleriesSearch by ColorPhoto Colour Explorer今天最新的照片昨天最新的照片用户照片相集过去每日精选照片相集Photography

Mayappan, Ramani (2012) Wetting and Intermetallic Study between Sn-3.5Ag-1.0Cu-xZn Lead-Free Solders and Copper Substrate (x = 0, 0.1, 0.4, 0.7). Advanced Materials Research, 501. 150-154 doi:10.4028/www.scientific.net/amr.501.150

Advanced
   -   Only viewable:
Reference TypeJournal (article/letter/editorial)
TitleWetting and Intermetallic Study between Sn-3.5Ag-1.0Cu-xZn Lead-Free Solders and Copper Substrate (x = 0, 0.1, 0.4, 0.7)
JournalAdvanced Materials Research
AuthorsMayappan, RamaniAuthor
Year2012 (April)Volume501
PublisherTrans Tech Publications, Ltd.
DOIdoi:10.4028/www.scientific.net/amr.501.150Search in ResearchGate
Generate Citation Formats
Mindat Ref. ID11680985Long-form Identifiermindat:1:5:11680985:0
GUID0
Full ReferenceMayappan, Ramani (2012) Wetting and Intermetallic Study between Sn-3.5Ag-1.0Cu-xZn Lead-Free Solders and Copper Substrate (x = 0, 0.1, 0.4, 0.7). Advanced Materials Research, 501. 150-154 doi:10.4028/www.scientific.net/amr.501.150
Plain TextMayappan, Ramani (2012) Wetting and Intermetallic Study between Sn-3.5Ag-1.0Cu-xZn Lead-Free Solders and Copper Substrate (x = 0, 0.1, 0.4, 0.7). Advanced Materials Research, 501. 150-154 doi:10.4028/www.scientific.net/amr.501.150
In(n.d.) Advanced Materials Research Vol. 501. Trans Tech Publications, Ltd.

See Also

These are possibly similar items as determined by title/reference text matching only.

Yahya, Iziana, Ab Ghani, Noor Asikin, Mohd Salleh, Mohd Arif Anuar, Abd Hamid, Hamidi, Ahmad, Zainal Arifin, Mayappan, Ramani (2012) Characterization of Sn-3.5Ag-1.0Cu Lead-Free Solder Prepared via Powder Metallurgy Method. Advanced Materials Research, 501. 160-164 doi:10.4028/www.scientific.net/amr.501.160
Yahya, Iziana, Ab Ghani, Noor Asikin, Abiddin, Nur Nadiah Zainal, Abd Hamid, Hamidi, Mayappan, Ramani (2012) Intermetallic Evolution of Sn-3.5Ag-1.0Cu-0.1Zn/Cu Interface under Thermal Aging. Advanced Materials Research, 620. 142-146 doi:10.4028/www.scientific.net/amr.620.142
Mayappan, Ramani, Zainal Abidin, Nur Nadiah, Ab Ghani, Noor Asikin, Yahya, Iziana, Shuhaime, Norlin (2016) Intermetallic Study on the Modified Sn-3.5Ag-1.0Cu-1.0Zn Lead Free Solder. Materials Science Forum, 857. 3-7 doi:10.4028/www.scientific.net/msf.857.3
Ab Ghani, Noor Asikin, Yahya, Iziana, Mohd Salleh, Mohd Arif Anuar, Saidatulakmar, Shamsuddin, Ahmad, Zainal Arifin, Mayappan, Ramani (2012) Microstructure Evolution of Sn-3.5Ag-1.0Cu-0.5Ni/Cu System Lead Free Solder under Long Term Thermal Aging. Advanced Materials Research, 620. 263-267 doi:10.4028/www.scientific.net/amr.620.263
Aishah Jasli, Nor, Abd Hamid, Hamidi, Mayappan, Ramani (2015) Morphology and Intermetallic Study of (Sn-8Zn-3Bi)-1Ni Solder under Liquid State Aging. Advanced Materials Research, 1087. 162-166 doi:10.4028/www.scientific.net/amr.1087.162
Liu, Huan, Xue, Feng, Zhou, Jian (2011) Study of Flux on Wetting Behavior of Sn-Zn Lead-Free Solders. Advanced Materials Research, 189. 3230-3237 doi:10.4028/www.scientific.net/amr.189-193.3230
Jasli, Nor Aishah, Abd Hamid, Hamidi, Mayappan, Ramani (2012) Morphology and Intermetallics Study of (Sn-8Zn-3Bi)-1Ag Solder under Liquid-State Aging. Advanced Materials Research, 620. 273-277 doi:10.4028/www.scientific.net/amr.620.273
Mohd Salleh, M.A.A., Somidin, Flora, Noriman, N.Z., Ahmad, Khairel Rafezi, Mayappan, Ramani, Alui, Noor Farhani Mohd (2013) Thermal Properties of Sn-0.7Cu/re-Al Composite Lead-Free Solder. Advanced Materials Research, 795. 451-454 doi:10.4028/www.scientific.net/amr.795.451
Mayappan, Ramani, Salleh, Amirah (2022) Intermetallic growth activation energy improvement in graphene doped Sn-3.5Ag solder. Materials Letters, 310. 131480pp. doi:10.1016/j.matlet.2021.131480
Mohd Salleh, Mohd Arif Anuar, Somidin, Flora, Al Bakri Abdullah, Mohd Mustafa, Noriman, N.Z., Mayappan, Ramani, Alui, Noor Farhani Mohd (2013) Effects of Recycled-Aluminum Additions on the Mechanical Properties of Sn-0.7Cu/Cu-Substrate Lead-Free Solder Joints. Advanced Materials Research, 795. 446-450 doi:10.4028/www.scientific.net/amr.795.446
Kim, Soon Tae, Huh, Joo Youl (2005) Enhanced Growth Kinetics of Intermetallic Compounds between Bi-Containing Sn-3.5Ag Solders and Cu Substrate during Aging. Materials Science Forum, 475. 2627-2630 doi:10.4028/www.scientific.net/msf.475-479.2627
 
and/or  
版权所有© mindat.org1993年至2026年，除了规定的地方。 Mindat.org全赖于全球数千个以上成员和支持者们的参与。
To cite: Ralph, J., Von Bargen, D., Martynov, P., Zhang, J., Que, X., Prabhu, A., Morrison, S. M., Li, W., Chen, W., & Ma, X. (2025). Mindat.org: The open access mineralogy database to accelerate data-intensive geoscience research. American Mineralogist, 110(6), 833–844. doi:10.2138/am-2024-9486.
隐私政策 - 条款和条款细则 - 联络我们 - Report a bug/vulnerability Current server date and time: 2026.6.7 10:21:52
Go to top of page